Silicon rod line production system and silicon rod line production method

Abstract

The invention discloses a silicon rod line production system and a silicon rod line production method. The silicon rod line production system comprises feeding equipment, cutoff equipment, silicon rod conveying equipment and a silicon rod combined machining machine, wherein the feeding equipment is used for conveying silicon rods to be cut to the feeding region; the cutoff equipment is in linkage with the feeding equipment and used for conducting cutoff work on the silicon rods which are to be cut and conveyed through the feeding equipment from the feeding region and cutting the silicon rods into multiple cut silicon rod sections; the silicon rod conveying equipment is in linkage with the cutoff equipment and used for conveying the cut silicon rod sections; and the silicon rod combined machining machine is arranged beside the silicon rod conveying equipment and used for conducting square cutting work, surface milling work, rounding work and polishing work on the cut silicon rod sections obtained from the silicon rod conveying equipment. By the adoption of the silicon rod line production system, the silicon rods to be cut are conveyed to the feeding region through the feeding equipment, the silicon rods to be cut are cut into multiple cut silicon rod sections through the cutoff equipment, the cut silicon rod sections are discharged in sequence through the silicon rod conveying equipment, and the square cutting work, surface milling work, rounding work and polishing work are conducted on the cut silicon rod sections through the silicon rod combined machining machine.

Description

technical field [0001] The invention relates to the technical field of cutting silicon rods, in particular to a silicon rod flow operation system and a silicon rod flow operation method. Background technique [0002] Silicon rod cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon rod, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire, and cut out the square. Ingot, so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and t...

AI Technical Summary

Problems solved by technology

[0003] However, there are still deficiencies in the current silicon rod cutting machine. For example, the current silicon rod cutting machine can only cut one objec

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