Diamagnetic AB glue free of base material and preparing method
A technology without base material and adhesive layer, applied in resin base material coating viscose coating process, antimagnetic base material AB adhesive film production process field, can solve performance simplification, increase thickness and cost, coating process cumbersome and other problems, to achieve the effect of reducing electromagnetic radiation, reducing the thickness of AB glue, and simplifying the installation procedure
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0025] In order to further understand the features, technical means, and achieved specific objectives and functions of the present invention, and to analyze the advantages and spirit of the present invention, the present invention will be further described through the following examples.
[0026] The present invention is realized by the following method: the antimagnetic substrate-free AB glue includes a release film 11 from bottom to top, a high-viscosity layer 13 is provided on the upper surface of the release film 11 (peeling layer), and a high-viscosity layer 13 is provided on the upper surface. There is a silica gel layer 15, and the upper surface of the silica gel layer 15 is covered with a protective film layer 17.
[0027] The thickness of the release film 11 is 23-100 μm. The thickness of the high-viscosity layer 13 is 20 μm˜80 μm. The thickness of the silica gel layer 15 is 20 μm˜80 μm. The thickness of the coating layer 17 is 30 μm to 100 μm.
[0028] Release fil...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 