Package cover plate and preparation method thereof, and display apparatus

A technology for encapsulating cover plates and inorganic layers, which is used in the manufacture of semiconductor/solid-state devices, electrical components, and electric solid-state devices, etc., and can solve the problems of water and oxygen barrier function failure of encapsulation cover plates, fracture of inorganic film 01, and low toughness.

Active Publication Date: 2016-09-28
BOE TECH GRP CO LTD
View PDF7 Cites 41 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since all the inorganic films 01 in this structure are flat planar structures, and the toughness of the inorganic films 01 is lower than that of the organic films 01, when all the inorganic films 01 are flat planar structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package cover plate and preparation method thereof, and display apparatus
  • Package cover plate and preparation method thereof, and display apparatus
  • Package cover plate and preparation method thereof, and display apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] An embodiment of the present invention provides a packaging cover plate 70, such as Figure 2-4 shown, including two first inorganic layers 10 and at least two organic layers 20 and at least one second inorganic layer 30 between the two first inorganic layers 10, the first inorganic layer 10, the organic layer 20 and the second The inorganic layers 30 are in close contact and arranged alternately. Wherein, the upper surface of the organic layer 20 in c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiments of the invention provide a package cover plate and a preparation method thereof, and a display apparatus, are applied to manufacturing of a package cover plate and an OLED display apparatus, and relate to the technical field of display, for the purposes of increasing the folding angle of a package cover plate and improving the problem of easy fractures of inorganic layers during long-term use. The package cover plate comprises two first inorganic layers, and at least two organic layers and at least one second inorganic layer which are disposed between the two first inorganic layers, wherein the first inorganic layers, the organic layers and the second inorganic layer are in close contact and are alternatively arranged, and multiple grooves are arranged in upper surfaces, which are in contact with the second inorganic layer, of the organic layers; the grooves are arranged at intervals along the direction of a foldable edge of the package cover plate; and for any one organic layer and the second inorganic layer which is disposed above and is in contact with the corresponding organic layer, the thickness of the second inorganic layer is the same as the height of the grooves of the surfaces of the organic layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging cover plate, a preparation method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) displays have the advantages of thinness, wide viewing angle, low power consumption, fast response speed, and flexible display. Therefore, OLED displays have been widely used in the display and lighting fields. [0003] The core component of an OLED display is an OLED device, which, as a new type of display device, has the advantages of high color gamut and high contrast. However, the luminescent materials and functional materials in the OLED device are sensitive to water and oxygen, so it is necessary to provide an encapsulation cover that blocks water and oxygen to form a protection for the OLED device. [0004] The package cover plate in the prior art, such as figure 1 As shown, a laminated structure in which the inorganic membrane 0...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/84H10K71/00
Inventor 李艺
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap