Package cover plate and preparation method thereof, and display apparatus

Abstract

The embodiments of the invention provide a package cover plate and a preparation method thereof, and a display apparatus, are applied to manufacturing of a package cover plate and an OLED display apparatus, and relate to the technical field of display, for the purposes of increasing the folding angle of a package cover plate and improving the problem of easy fractures of inorganic layers during long-term use. The package cover plate comprises two first inorganic layers, and at least two organic layers and at least one second inorganic layer which are disposed between the two first inorganic layers, wherein the first inorganic layers, the organic layers and the second inorganic layer are in close contact and are alternatively arranged, and multiple grooves are arranged in upper surfaces, which are in contact with the second inorganic layer, of the organic layers; the grooves are arranged at intervals along the direction of a foldable edge of the package cover plate; and for any one organic layer and the second inorganic layer which is disposed above and is in contact with the corresponding organic layer, the thickness of the second inorganic layer is the same as the height of the grooves of the surfaces of the organic layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging cover plate, a preparation method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) displays have the advantages of thinness, wide viewing angle, low power consumption, fast response speed, and flexible display. Therefore, OLED displays have been widely used in the display and lighting fields. [0003] The core component of an OLED display is an OLED device, which, as a new type of display device, has the advantages of high color gamut and high contrast. However, the luminescent materials and functional materials in the OLED device are sensitive to water and oxygen, so it is necessary to provide an encapsulation cover that blocks water and oxygen to form a protection for the OLED device. [0004] The package cover plate in the prior art, such as figure 1 As shown, a laminated structure in which the inorganic membrane 0...

AI Technical Summary

Problems solved by technology

However, since all the inorganic films 01 in this structure are flat planar structures, and the toughness of the inorganic films 01 is lower than that of the organic films 01, when all the inorganic films 01 are flat planar structures, this will result in The package cover of the structure has a small bending angle

Moreover, during long-term use, the inorganic film 01 is likely to break and cause the water and oxygen barrier function of the package cover to fail.

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