Wafer Thinning Methods

Abstract

The present invention provides a wafer thinning method. The method comprises: providing a first wafer to be thinned, wherein the first wafer includes a right side configured to form a semiconductor device and a back side relative to the right side; forming a first inorganic material layer at the right side of the first wafer; providing a second wafer configured to support the first wafer, wherein the second wafer includes a work surface configured to match the right side of the first wafer; forming a second inorganic material layer on the work surface of the second wafer; bonding the first inorganic material layer and the second inorganic material layer to bond the first wafer and the second wafer; removing the partial materials of the back side of the first wafer to perform thickness thinning process of the first wafer; and bonding the thinned first wafer and the second wafer. The bearing capacity for the environment temperature is widened so as to facilitate reducing the difficulty and the complexity of other technologies and ensure the efficiency of the whole technology.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer thinning method. Background technique [0002] Packaging technology is essentially a chip packaging technology. This packaging is necessary for the chip because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, packaged chips are also easier to install and transport. The quality of the packaging technology directly affects the performance of the chip itself and the design and manufacture of the printed circuit board connected to it. [0003] The current packaging technology has gradually transitioned from surface mount technology and ball grid array terminal packaging technology (Ball GridArray, BGA) to three-dimensional packaging technology (3D Package). Three-dimensional packaging technology can be divided into three-dimensional ...

AI Technical Summary

Problems solved by technology

[0004] However, when the wafer is thinned below a certain thickness, the wafer becomes extremely brittle, such as warping, deforming or even chipping

However, in order to avoid wafer cracking and deformation as far as possible in the existing technology, many restrictions are imposed on various processes during wafer production and bonding, which will lead to lower overall production efficiency.

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