Novel XFP optical module structure

Abstract

The invention discloses a novel XFP optical module structure. The novel XFP optical module structure comprises a base and a cover plate matched with the base. An optical port set with optical ports which are independent from one another and are in an enclosure state is arranged on one side of the base, and a boss used for assisting in heat dissipation of a PCB main chip is further arranged on a PCB installation position on the base. Paired heat dissipating spacers which cooperate with one another so as to assist in heat dissipation of a light-emitting assembly are arranged between the base and the cover plate. According to the novel XFP optical module structure, by changing the internal structure of a module, the effects that the same style of XFP structural member is compatible to a rectangular encapsulated light-emitting assembly, a round encapsulated light-emitting assembly, an LC adaptor light receiving assembly and an XMD adaptor light receiving assembly, module plugging performance and signal transmission stability are improved, and meanwhile the product production cost and stock and management cost are reduced are achieved.

Description

technical field [0001] The invention relates to an optical module used in the case of optical communication. More specifically, the present invention relates to a novel XFP optical module structure used in the case of optical communication. Background technique [0002] Although XFP modules are widely used in today's fast-developing Internet, the structural components of XFP modules currently on the market are mainly connected by the base and the upper cover through screws, and the assembly of the optical module has been completed. [0003] The existing problems are that, first, the optical port of the module is also formed by the combination of the base and the cover plate, and due to the existence of assembly gaps and casting tolerances, the center position of the optical component adapter port in the optical port of the module often deviates, resulting in the module The output power jumps and the fiber jumper is not plugged smoothly; secondly, as the package structure of...

AI Technical Summary

Problems solved by technology

[0003] The existing problems are that, first, the optical port of the module is also formed by the combination of the base and the cover plate, and due to the existence of assembly gaps and casting tolerances, the center position of the optical component adapter port in the optical port of the module often deviates, resulting in the module The output power jumps and the fiber jumper is not plugged smoothly; secondly, as the package structure of the components becomes smaller and the shapes are more diverse, the heat dissipation requirements of the optical components for the modules are getting higher and higher, and the pressure of product costs is increasing. The XFP module structure must be improved accordingly to meet the requirements of the new application environment for module performance

Images