Novel XFP optical module structure

An optical module and a new type of technology, applied in the field of optical modules, can solve the problems of uneven insertion and removal of optical fiber jumpers, deviation of the center position of the optical component adapter port, and jumping of the optical power of the module.

Active Publication Date: 2016-10-12
四川华拓光通信股份有限公司 +1
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Problems solved by technology

[0003] The existing problems are that, first, the optical port of the module is also formed by the combination of the base and the cover plate, and due to the existence of assembly gaps and casting tolerances, the center position of the optical component adapter port in the optical port of the module often deviates, resulting in the module The output power jumps and the fiber jumper is not plugge...

Method used

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  • Novel XFP optical module structure
  • Novel XFP optical module structure
  • Novel XFP optical module structure

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Embodiment Construction

[0040] The present invention / invention will be described in further detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0041] It should be understood that terms such as "having", "comprising" and "including" as used herein do not entail the presence or addition of one or more other elements or combinations thereof.

[0042] Figure 1-4 The realization form of a kind of novel XFP optical module structure according to the present invention is shown, including:

[0043] Base 1, one side of which has independent and enclosed optical port groups a, which is used to integrate the module optical port into the module base, effectively avoiding the gap between the base and the upper cover during the assembly process. The impact of the size of the optical port ensures the relative position of the optical component adapter port in the module optical port, and the base is also provided with a ...

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Abstract

The invention discloses a novel XFP optical module structure. The novel XFP optical module structure comprises a base and a cover plate matched with the base. An optical port set with optical ports which are independent from one another and are in an enclosure state is arranged on one side of the base, and a boss used for assisting in heat dissipation of a PCB main chip is further arranged on a PCB installation position on the base. Paired heat dissipating spacers which cooperate with one another so as to assist in heat dissipation of a light-emitting assembly are arranged between the base and the cover plate. According to the novel XFP optical module structure, by changing the internal structure of a module, the effects that the same style of XFP structural member is compatible to a rectangular encapsulated light-emitting assembly, a round encapsulated light-emitting assembly, an LC adaptor light receiving assembly and an XMD adaptor light receiving assembly, module plugging performance and signal transmission stability are improved, and meanwhile the product production cost and stock and management cost are reduced are achieved.

Description

technical field [0001] The invention relates to an optical module used in the case of optical communication. More specifically, the present invention relates to a novel XFP optical module structure used in the case of optical communication. Background technique [0002] Although XFP modules are widely used in today's fast-developing Internet, the structural components of XFP modules currently on the market are mainly connected by the base and the upper cover through screws, and the assembly of the optical module has been completed. [0003] The existing problems are that, first, the optical port of the module is also formed by the combination of the base and the cover plate, and due to the existence of assembly gaps and casting tolerances, the center position of the optical component adapter port in the optical port of the module often deviates, resulting in the module The output power jumps and the fiber jumper is not plugged smoothly; secondly, as the package structure of...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4255G02B6/4269G02B6/4287
Inventor 范巍刘金
Owner 四川华拓光通信股份有限公司
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