Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

A kind of preparation method of earpiece film

A film and earpiece technology, applied in the field of earpiece film and its preparation, can solve the problems such as the inability to emit the best sound quality of the sound film material, the inability to achieve ultra-thin thickness, the unreasonable setting structure, etc. Transient, film-thin effects

Active Publication Date: 2021-06-22
DONGGUAN FORBETTER PLASTIC & ELECTRONICS PRODS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among them, paper films have been around for a long time and are widely used in some speakers. However, due to the shortcomings of paper films, which are easy to be affected by moisture, the sound quality is unstable, and they are gradually replaced by other films.
Plastic film has the advantages of low cost, good plasticity, and easy processing, but the rigidity of plastic film is poor, which seriously affects the sound quality of the speaker
However, no matter paper material or plastic material, due to material reasons, it is impossible to achieve ultra-thin thickness, and the structure of the setting is unreasonable, so it is impossible to produce the best sound quality of the sound film material.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of earpiece film
  • A kind of preparation method of earpiece film
  • A kind of preparation method of earpiece film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A method for preparing an earpiece film, comprising the following steps,

[0042] Step (A): Overlap, cut, punch and cut the middle original film and the surface original film to make a cover film. The cover film includes 2 sets of middle frames formed by the middle original film and 3 sets of surface frames punched out of the surface original film ;

[0043] Step (B): Use the fan gate to fill out the original engineering film, and then punch and cut it into small pieces to make the engineering film group;

[0044] Step (C): Clean the middle frame group 2, the surface frame group 3 and the engineering film group, coat the upper and lower surfaces of the middle frame group 2 with powder and glue, and then attach the surface frame group 3 to the upper surface of the middle frame group 2 , and finally stick the engineering film group on the lower surface of the middle frame 2 group, stamping and cutting out several earpiece films;

[0045] Wherein, the engineering film gr...

Embodiment 2

[0056] The difference between this embodiment and Embodiment 1 lies in that the fan gate filling temperature in step (B) of this embodiment is 120°C, the locking pressure is 40 bar, and the locking speed is 12s. The cleaning described in the step (C) is specifically coating and cleaning twice with a silica gel cleaning agent, and the coating thickness is 0.5 mm. The powder coating in the step (C) is specifically to use beryllium copper metal powder to spray on the surface frame 3 , the spraying temperature is 80° C., and the spraying thickness is 0.02 mm. The gluing in the step (C) uses a silane adhesive, the gluing pressure is 60 bar, and the hardness of the silane adhesive is 70 degrees.

[0057] The intermediate original film is composed of PEN:PEEK with a mass fraction of 1:2.

[0058] The Young's modulus of the earpiece film is 5400N / mm 2 , with a density of 1.3g / cm 3 , the glass transition temperature is 150°C, the relative damping is 0.48, the elongation is 400%, the...

Embodiment 3

[0060] The difference between this embodiment and embodiment 1 lies in that the fan gate filling temperature in step (B) is 110° C., the locking pressure is 20 bar, and the locking speed is 10 s. The cleaning described in the step (C) is specifically to use a silica gel cleaning agent to coat and wash twice, and the thickness of the coating is 0.2 mm. The powder coating in the step (C) is specifically to use beryllium copper metal powder to spray on the surface frame 3 , the spraying temperature is 110° C., and the spraying thickness is 0.03 mm. The gluing in the step (C) uses a silane adhesive, the gluing pressure is 60 bar, and the hardness of the silane adhesive is 70 degrees.

[0061] The intermediate original film is composed of PU:PET with a mass fraction of 1:2.

[0062] The Young's modulus of the earpiece film is 5200N / mm 2 , with a density of 1.2g / cm 3 , the glass transition temperature is 130°C, the relative damping is 0.45, the elongation is 300%, the tensile str...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to the field of sound film technology, in particular to an earpiece film and a preparation method thereof, comprising the following steps: step (A): overlapping, cutting, punching and cutting the middle original film and the surface original film to produce a casing film, the casing film includes: The middle frame group formed by the middle original film, and the surface frame group punched out by the surface original film; step (B): use the fan gate to fill out the original engineering film, and then stamp and cut it into small pieces to make the engineering film group; step (C) : Clean the middle frame group, surface frame group and engineering film group, coat the upper and lower surfaces of the middle frame group with powder and glue, then stick the surface frame group on the upper surface of the middle frame group, and finally stick the engineering film group on the The lower surface of the middle frame group is stamped and cut into several earpiece films. The preparation method of the earpiece film of the present invention is simple, can be mass-produced, and can prepare a micro-miniature earpiece film, and the prepared earpiece film has high elasticity, high toughness, good transient state, sensitivity, frequency response, and long-lasting good performance. sound quality.

Description

technical field [0001] The invention relates to the technical field of sound film, in particular to an earpiece film and a preparation method thereof. Background technique [0002] With the improvement of people's living standards, the requirements for a series of audio facilities such as earphones and speakers are getting higher and higher, especially for mobile phones and in-ear earplug speakers. The development trend is to have better and better sound effects and more and more Smaller sound generators. As one of the key components of the sound generator, the thin film has a vital impact on the sound quality of the speaker, and it is more difficult to prepare a small earpiece thin film. Therefore, the design of small earpiece thin films has always been one of the important topics of continuous innovation in the industry. [0003] The objective indicators such as the frequency response curve of the speaker are mainly determined by the geometry of the film, while the subjec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04R7/12
CPCH04R7/122
Inventor 邢和平汤教颉丘富强殷海锋王雪胜叶友志
Owner DONGGUAN FORBETTER PLASTIC & ELECTRONICS PRODS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com