cabinet

Abstract

This application discloses the cabinet. A specific embodiment of the method comprises: a cabinet housing and a cabinet cavity disposed within the cabinet housing, a liquid working fluid placement area, a heat exchanger, a transmission channel, wherein: the cabinet cavity is set to a vacuum state and for placing the electronic device to be cooled; The liquid working fluid placement area is used to place the liquid working medium, wherein the liquid working medium is converted into a gaseous working medium into the heat exchanger after cooling the electronic device to be cooled; The heat exchanger is used to liquefy the gaseous working medium as a liquid working medium and introduce the liquid working medium from the liquefaction of the gaseous working medium into the transmission channel; The transmission channel connects the heat exchanger and the liquid working fluid placement area, and is used to introduce the liquid working medium from the liquefaction of the gaseous working medium into the liquid working fluid placement area. This embodiment eliminates the impact of humidity, cleanliness, etc. brought by air circulation on the electronic equipment, thereby extending the life of the electronic equipment.

Description

technical field [0001] The present application relates to the technical field of hardware equipment, in particular to the technical field of heat dissipation hardware, and in particular to cabinets. Background technique [0002] With the deepening of informatization and the development of various industries, such as the development of the mobile Internet industry and the Internet of Things industry, more and more devices are connected to the network. The resulting large increase in data transmission has brought about a large increase in the development of networks and the construction of data centers. Therefore, more and more electronic devices, such as servers, routers, and switches, are required to process data. [0003] However, for the existing data center equipment heat dissipation technology, please refer to Figure 1a The traditional cooling scheme 1 shown in the traditional cooling scheme 1 is to use the convective circulation of air to cool the server. The differenc...

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Problems solved by technology

[0003] However, for the equipment heat dissipation technology of the existing data center, please refer to Figure 1a The traditional cooling scheme 1 shown in the traditional cooling scheme 1 is to use the convective circulation of air to cool the server. The difference may be that the position of the terminal air conditioner (the device that converts hot air into cold air) is different, or in the corner of the room, Either next to the cabinet, or on top of the cabinet, or at the bottom of the cabinet; refer to the Figure 1b The traditional cooling scheme 2 shown in the traditional cooling scheme 2 uses a backplane heat exchanger for backplane-level air cooling. The backplane-level air cooling has a good energy-saving effect, but there is still air circulation

Air circulation will inevitably have control problems of humidity and cleanliness (dust, harmful gases). Even today, when servers have more and more requirements for these, the above factors still restrict the life of electronic equipment, so there is a problem that the life of electronic equipment is relatively long. low problem

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