A high temperature pump cooling device

Abstract

The invention discloses a heat radiation device of a high-temperature pump, and belongs to the technical field of water pumps. The heat radiation device of the high-temperature pump comprises an inlet connecting pipe, a heat radiator, a pump shaft and an outlet connecting pipe. The heat radiator comprises outer ring rectangular grooves, heat radiation holes, inner ring rectangular grooves, flow guide partition plates and spiral grooves. The outer ring rectangular grooves, the heat radiation holes and the inner ring rectangular grooves of the heat radiator are divided into an upper layer, a middle layer and a lower layer, and the three layers are completely the same in structure and are arranged at equal intervals. The radial width of the outer ring rectangular grooves of the heat radiator is the same as that of the inner ring rectangular grooves of the heat radiator. The flow guide partition plates are arranged on the two sides of the outer ring rectangular grooves of the heat radiator perpendicular to the inlet connecting pipe and the outlet connecting pipe. The connecting line of the flow guide partition plates and the center axis is in a V shape, the included angle is 15 degrees, and the heat radiation holes in the two sides of the flow guide partition plates are formed symmetrically. The spiral grooves are formed in the upper end of the heat radiator. Liquid nitrogen serves as a heat radiation medium. The heat radiator is fixed to the pump device through four screws, and screw holes are distributed evenly. The diameter and the length of the inlet connecting pipe are the same as those of the outlet connecting pipe. The heat radiation device is reasonable in structure, even in heat radiation and good in effect.

Description

technical field [0001] The invention belongs to the technical field of water pumps, in particular to a high-temperature pump cooling device. Background technique [0002] High-temperature pumps are generally vertical pumps. When the pump is working, the temperature can reach as high as 600°C to 700°C. Considering that the coupling on the shaft can only withstand a temperature of about 80°C, it is particularly important to design the heat dissipation system of the high-temperature pump. Due to the large temperature difference, a large amount of heat dissipation is required, which puts forward higher requirements on the structure of the radiator system and the heat dissipation medium. At present, the research on pump cooling devices is relatively scarce, especially the research on high temperature pump cooling devices, and there is a lack of reference examples in the design of radiator structures. For example, the space bracket radiator for fluoroplastic pumps recorded in Chi...

AI Technical Summary

Problems solved by technology

For example, the space bracket radiator for fluoroplastic pumps recorded in Chinese patent literature [Application No.: 201510673048.3; Publication No.: CN105275889A] designed a "~"-shaped cooling blade to balance the temperature between the shaft and the pump bracket, but This structure has limited heat dissipation effect and is not suitable for heat dissipation of high temperature pumps

Images