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Optimization method and device of single-impact stress screening condition

A technology of impact stress and screening conditions, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as limited application scenarios

Active Publication Date: 2016-10-26
36TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a method and device for optimizing single impact stress screening conditions to solve the problem of limited application scenarios of single impact stress screening schemes in the prior art

Method used

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Embodiment 1

[0062] figure 1 The flow chart of the optimization method for the single impact stress screening conditions provided in this embodiment, such as figure 1 As shown, the method includes:

[0063] S110, establishing a reliability model of the product according to the failure threshold pair of the product, and obtaining a working life distribution function of the non-damaged product and a working life distribution function of the product failing only due to impact stress during use.

[0064] During the product manufacturing process, due to non-standard materials or other factors, some products with potential defects and damages (such as microcracks) may be produced. These defective products are prone to failure due to accumulated damage during use. Compared with products without potential defects and damages, there is an additional failure mode—the mode of failure due to cumulative damage, so this embodiment establishes The product reliability model distinguishes non-damaged pro...

Embodiment 2

[0121] The optimization method of multiple impact stress screening conditions in Example 1 is applicable to the common situation where the initial non-damaged products and the initially intact products with defects after screening have different life functions, especially suitable for the damage size caused by impact stress conforming to normal distributed products. For example, when a solder joint with microcracks receives an external impact, the crack will gradually expand, and when the crack size reaches a certain limit, the fracture will fail. Therefore, the optimization method for the single impact stress screening condition in Example 1 can be used for solder joints. Point single impact stress screening.

[0122] When modeling the single impact stress screening process, it is assumed that the base failure rate of undamaged products is r(t)=0.001, the non-homogeneous Poisson distribution strength function λ(t)=0.001, and the failure threshold D w = 4, the proportion of i...

Embodiment 3

[0127] This embodiment adopts the same design concept as that of the first embodiment, and provides an optimization device for single impact stress screening conditions.

[0128] Figure 4 The optimization device structure block diagram of the single impact stress screening condition that this embodiment provides, as Figure 4 As shown, the device includes:

[0129] The reliability modeling unit 41 is used to establish a reliability model of the product according to the failure threshold of the product, and obtain the distribution function of the working life of the product without damage and the distribution function of the working life of the product that fails only due to impact stress during use.

[0130] Among them, the working life distribution function of non-damaged products is specifically

[0131] The working life distribution function of the product that fails only due to impact stress during use is specifically:

[0132] T in the above formula N is the life...

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Abstract

The invention discloses an optimization method and device of a single-impact stress screening condition. The method comprises the following steps: according to the failure threshold value of a product, establishing a reliability model of the product to obtain the operating life distribution function of a no-damage product and the operating life distribution function of a product which fails only due to impact stress in a use process; on the basis of the failure threshold value of the product, establishing a single-impact stress screening process model for a determined value to obtain the normalized life distribution function of a non-failure product after single-impact stress screening, wherein the product which does not have initial damage but has damages after screening and the product which has the initial damage but passes the screening have different life distribution functions; according to the expected life of the product, optimizing the normalized life distribution function of the product to obtain the optimized single-impact stress screening condition. The method can adapt to a situation that the product without initial damages and the product which is initially compact but has defects after screening have different life functions, and enriches an application scene of the single-impact stress screening condition.

Description

technical field [0001] The invention relates to the technical field of reliability engineering, in particular to a method and device for optimizing screening conditions of single impact stress. Background technique [0002] In the process of product development, environmental stress screening test is an effective means to eliminate potential defects and damages introduced in the manufacturing process of products. For example, for aerospace electronic products, environmental stress screening at device level, board level, and stand-alone level is often required before launching with satellites. At present, the selection of environmental stress screening test conditions is often determined based on engineering experience or various specifications, and is rarely determined based on the actual development and application of specific products. There may be the following problems in the selection of environmental stress screening test conditions: first, defects and damage to the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 尤明懿吕强
Owner 36TH RES INST OF CETC
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