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A method and device for optimizing screening conditions of single impact stress

A technology of impact stress and screening conditions, applied in special data processing applications, instruments, calculations, etc., and can solve problems such as limited application scenarios

Active Publication Date: 2019-05-24
36TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a method and device for optimizing single impact stress screening conditions to solve the problem of limited application scenarios of single impact stress screening schemes in the prior art

Method used

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  • A method and device for optimizing screening conditions of single impact stress
  • A method and device for optimizing screening conditions of single impact stress
  • A method and device for optimizing screening conditions of single impact stress

Examples

Experimental program
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Embodiment 1

[0062] figure 1 The flow chart of the method for optimizing screening conditions of single impact stress provided in this embodiment, such as figure 1 As shown, the method includes:

[0063] S110: Establish the reliability model of the product according to the failure threshold of the product, and obtain the working life distribution function of the undamaged product and the working life distribution function of the product that fails only due to impact stress during use.

[0064] During the product manufacturing process, due to non-standard materials or other factors, some products with potential defects and damages (such as microcracks) may be manufactured. These defective products are prone to failure due to accumulated damage during use. Compared with products without potential defects or damage, there is an additional failure mode—because of the cumulative damage failure mode, so this embodiment establishes The product reliability model distinguishes non-damaged products and...

Embodiment 2

[0121] The optimization method of multiple impact stress screening conditions in the first embodiment is suitable for the common situations where the initial non-damaged products and the products that are initially intact but produce defects after screening have different life functions, especially suitable for the damage size caused by the impact stress conforms to the normal Distribution products. For example, when a solder joint with microcracks receives an external impact, the crack will gradually expand, and when the crack size reaches a certain limit, the fracture will fail. Therefore, the optimization method of single impact stress screening conditions in Example 1 can be used for welding Single impact stress screening of points.

[0122] When modeling the single impact stress screening process, it is assumed that the base failure rate of the undamaged product is r(t) = 0.001, the inhomogeneous Poisson distribution intensity function λ(t) = 0.001, and the failure threshold...

Embodiment 3

[0127] This embodiment adopts the same design concept as the first embodiment, and provides an optimization device for single impact stress screening conditions.

[0128] Figure 4 The structural block diagram of the device for optimizing screening conditions of single impact stress provided in this embodiment, such as Figure 4 As shown, the device includes:

[0129] The reliability modeling unit 41 is used to establish the reliability model of the product according to the failure threshold of the product, and obtain the working life distribution function of the non-damaged product and the working life distribution function of the product that fails only due to impact stress during use.

[0130] Among them, the working life distribution function of non-damaged products is specifically

[0131] The working life distribution function of the product that fails only due to impact stress during use is specifically

[0132] T in the above formula N Is the life of the product without dama...

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Abstract

The invention discloses an optimization method and device of a single-impact stress screening condition. The method comprises the following steps: according to the failure threshold value of a product, establishing a reliability model of the product to obtain the operating life distribution function of a no-damage product and the operating life distribution function of a product which fails only due to impact stress in a use process; on the basis of the failure threshold value of the product, establishing a single-impact stress screening process model for a determined value to obtain the normalized life distribution function of a non-failure product after single-impact stress screening, wherein the product which does not have initial damage but has damages after screening and the product which has the initial damage but passes the screening have different life distribution functions; according to the expected life of the product, optimizing the normalized life distribution function of the product to obtain the optimized single-impact stress screening condition. The method can adapt to a situation that the product without initial damages and the product which is initially compact but has defects after screening have different life functions, and enriches an application scene of the single-impact stress screening condition.

Description

Technical field [0001] The invention relates to the technical field of reliability engineering, in particular to a method and a device for optimizing single impact stress screening conditions. Background technique [0002] In the product development process, the environmental stress screening test is a commonly used effective method to eliminate potential defects and damages introduced in the product manufacturing process. For example, for aerospace electronic products, before launching with satellites, it is often necessary to carry out environmental stress screening at the device level, board level, and stand-alone level. At present, the selection of environmental stress screening test conditions is often determined based on engineering experience or various specifications, and is rarely determined based on the actual development and application of specific products. This method of selecting environmental stress screening test conditions may have the following problems: first,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 尤明懿吕强
Owner 36TH RES INST OF CETC
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