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Application of ruthenium or ruthenium compound in preparing thick-film heating element, thick-film heating element with ruthenium or ruthenium compound, and resistance paste thereof

A technology of thick film heating and resistance paste, which is applied in the direction of heating element materials, etc., can solve the problems of using parallel heating circuits, thick film heating circuits, etc., and achieve the effects of cost advantages, controllable square resistance changes, and stable refiring changes

Inactive Publication Date: 2016-10-26
新乡市杰达精密电子器件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the palladium-silver paste cannot prepare a large resistance paste, the parallel heating circuit has not been used in the thick film heating circuit.

Method used

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Examples

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Embodiment Construction

[0019] The present invention will be described in detail below in conjunction with the embodiments.

[0020] Application of ruthenium or ruthenium compounds in preparing thick film heating elements.

[0021] The heating circuit of the thick film heating element is a parallel circuit.

[0022] The ruthenium or ruthenium compound is added in the resistance paste for printing the heating circuit of the thick film heating element.

[0023] The ruthenium compound is ruthenium dioxide or bismuth ruthenate.

[0024] Another object of the present invention is to provide a thick film heating element, the heating circuit of the thick film heating element is a parallel circuit, and the resistance paste for printing the heating circuit contains ruthenium or a ruthenium compound.

[0025] The invention also provides a resistance paste for printing a parallel thick film heating circuit, which includes a conductive phase, an inorganic binder phase and an organic carrier, and the conductive...

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Abstract

The invention discloses an application of ruthenium or a ruthenium compound in preparing a thick-film heating element, the thick-film heating element with the ruthenium or the ruthenium compound, and a resistance paste thereof. According to the invention, through providing a new resistance paste of the thick-film heating element, namely replacing a conductive phase by the ruthenium or the ruthenium compound by means of existing thick-film resistance paste preparing technology, problems of influence degree increase to a square resistance and high reheating linear change rate are settled on condition that glass phase in the resistance paste increases to a certain amount in prior art. Through a large number of researching experiments, an application discovers a fact that controllable square resistance change and stable reheating linear change are realized after glass phase increase through replacing the conductive phase in an existing palladium silver paste by the ruthenium or ruthenium compound. Based on the fact, the applicant provides the resistance paste which comprises the ruthenium or the ruthenium compound. The resistance paste can be successfully applied in a parallel thick-film heating circuit, and the relatively large square resistance can ensure adjustable and controllable circuit resistance after parallel connection. The application of the ruthenium or the ruthenium compound, the thick-film heating element and the resistance paste effectively settle a problem of easy serial-connected thick-film heating circuit damage in prior art. Furthermore the invention provides a thick-film heating circuit in a parallel-connection manner.

Description

technical field [0001] The invention relates to thick-film heating technology, in particular to the application of ruthenium or ruthenium compounds in preparing thick-film heating elements, thick-film heating elements containing the substance and resistance paste. Background technique [0002] The stainless steel thick film heating element is mainly composed of a stainless steel substrate, an inner insulating medium layer, a resistance heating layer and an outer insulating medium layer from the inside to the outside. The water flows through the inner wall of the stainless steel, and the thickness of the inner insulating medium layer is about 100 microns. The heat conduction distance from the heating layer to the stainless steel substrate is short, so the thermal resistance is small and the thermal response speed is fast. Thick film heating belongs to surface heating, and the overall heating is relatively uniform, and the heating efficiency will not be reduced due to a large ...

Claims

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Application Information

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IPC IPC(8): H05B3/12
CPCH05B3/12
Inventor 杨睿达杨明懿
Owner 新乡市杰达精密电子器件有限公司
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