Assembly equipment for SMD chip mounting lamp

A technology for assembling equipment and SMD lamps, which is used in metal processing equipment, lamp testing, measuring devices, etc. It can solve the problems of reduced product quality and production efficiency, inability to realize real-time detection, product damage, etc., and improve production efficiency and quality. , easy to control, the effect of reducing the defective rate

Inactive Publication Date: 2021-04-02
佛山市磊鑫光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide assembly equipment for SMD patch lamps to solve the problems of product damage, product quality and production efficiency reduction, and inability to realize real-time detection proposed in the above-mentioned background technology

Method used

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  • Assembly equipment for SMD chip mounting lamp
  • Assembly equipment for SMD chip mounting lamp
  • Assembly equipment for SMD chip mounting lamp

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Embodiment Construction

[0029] The following will be combined with Figure 1 to Figure 5 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on th...

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Abstract

The invention relates to the technical field for SMD chip mounting lamp production equipment, in particular to assembly equipment for an SMD chip mounting lamp. The equipment comprises a table top, wherein a stand column is welded to the outer wall of the top of the table top, a first sliding groove is formed inside the stand column, a first sliding block is slidably connected into the first sliding groove, a first ball nut is connected into the first sliding block through a bolt, a first lead screw is connected into the first ball nut through threads, a cantilever is arranged on one side of the stand column, one end of the cantilever is connected to the first sliding block through a bolt, a second sliding groove is formed inside the cantilever, a second sliding block is connected into thesecond sliding groove in a sliding mode, and a second ball nut is connected into the second sliding block through a bolt. According to the equipment, an adsorption plate is connected to a vacuum pump, so that the adsorption plate adsorbs a protective layer, the protective layer cannot be damaged in an assembling process, the defect that in the prior art, when a clamp is adopted for clamping the protective layer for assembling, the protective layer is prone to damage is overcome, and then the assembling quality is improved.

Description

technical field [0001] The invention relates to the technical field of patch lamp production equipment, in particular to assembly equipment for SMD patch lamps. Background technique [0002] SMD patch lamps are surface mount light-emitting diodes. SMD patches help to improve production efficiency and the application of different facilities. It is a solid-state semiconductor device that can directly convert electricity into light. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy resin. In the production process of SMD patch lamps, often It is necessary to paste a protective layer on the surface of the SMD patch lamp, so that the SMD patch lamp can emit light of different colors, and prolong the service life of the SMD patch lamp. [0003] Chinese Patent No. 201711147223.0 disclos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/00G01R31/44G01M11/00
CPCB23P19/00G01M11/00G01R31/44
Inventor 吴浩赖春生
Owner 佛山市磊鑫光电科技有限公司
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