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Wiring thin plate having aerial wiring portion and method of manufacturing the same

一种布线、薄板的技术，应用在印刷电路制造、头的流体动力学间距、记录头的配置/安装等方向

Active Publication Date: 2016-11-02
NHK SPRING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this structure forms the base insulating layer using a resin such as polyimide, the base insulating layer is thinned by etching, and thus there is variation in the thickness of the thinned portion between products

Method used

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  • Wiring thin plate having aerial wiring portion and method of manufacturing the same
  • Wiring thin plate having aerial wiring portion and method of manufacturing the same
  • Wiring thin plate having aerial wiring portion and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The wiring sheet according to the embodiment of the present invention will be described in detail. Each embodiment embodies one of the first to third wiring sheets to suppress deterioration of electrical characteristics and variation in thickness of the overhead wiring portion while promoting reduction in stiffness of the overhead wiring portion.

[0032] The first wiring sheet has: a support layer, which is made of metal; an insulating base layer, which is provided on the top surface of the support layer; a wiring part, which has a plurality of wiring traces provided on the top surface of the base layer; A covering layer, which covers the wiring traces; a void, which is defined in the support layer; an overhead wiring portion, which is a part of the wiring portion which passes over the void; an overhead base layer, which is provided at the respective wiring traces in the overhead wiring portion on the base layer and spaced apart from each other; and an overhead cover l...

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PUM

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Abstract

Provided is a wiring thin plate capable of suppressing deterioration of an electric characteristic and variation in thickness of an aerial wiring portion while advancing reduction of rigidity of the aerial wiring portion. The wiring thin plate includes an aerial wiring portion including wiring traces and passing over an airspace, aerial base layers provided at the respective wiring traces in the aerial wiring portion and being apart from each other, and an aerial cover layer provided in the aerial wiring portion and spanning from the wiring traces of the aerial wiring portion through the aerial base layers to interspaces between adjacent aerial base layers of said aerial base layers.

Description

technical field [0001] The present invention relates to a wiring sheet, which is applied to a flexure of a head suspension, etc., and a method of manufacturing the wiring sheet. Background technique [0002] The hard disk drive includes hard disks that are set to rotate at high speed and head suspensions that have sliders that are slightly lifted from the respective hard disks to write data to or read data from the hard disks. Each head suspension has a flexure through which the slider is attached to the head suspension. The flexure includes a wiring portion formed on a metal substrate. The front end portion of the metal substrate is provided with a tongue to which the slider is attached. [0003] Current hard disks have a high recording density, and thus require the slider of the head suspension to achieve a lower flying height. In order to stabilize the low flying height, it is important to control the stiffness of the metal substrate and routing sections around the fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02G11B5/60
CPCG11B5/60H05K1/028H05K2201/053H05K1/056H05K3/28H05K2201/09872H05K2203/0323G11B5/484G11B5/486G11B5/4853
Inventor 山田幸惠
Owner NHK SPRING CO LTD
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