Adhesive bonding device and adhesive bonding method for silicon blocks
A technology of viscose and silicon blocks, which is applied in the direction of fine working devices, working accessories, stone processing equipment, etc., can solve problems such as untightened, abnormal cutting quality, and quality loss, so as to prevent sticking, improve production efficiency, and reduce The effect of viscose working time
Inactive Publication Date: 2016-11-09
CHONGQING DAQO NEW ENERGY
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Problems solved by technology
[0002] The traditional gluing method needs to be glued to the glass plate and the silicon block at an interval of more than 30 minutes, and when the glass plate is glued, the glass plate is prone to sticking (the glass plate is not placed in the middle of the iron plate) phenomenon, resulting in abnormal cutting quality; the screw hole of each rod is 8 / 10 pieces, it takes 10 minutes / knife from installation to removal, and there are often phenomena such as bolt slippage, untightened, forgetting to install, etc., resulting in serious quality loss
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[0035] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and examples are only used to explain the present invention, and are not intended to limit the scope of the present invention.
[0036] Such as figure 1 , figure 2 As shown, an embodiment of the gluing device of the present invention includes a gluing table backing plate 1, and two glass plate positioning columns 2 are arranged on the gluing table backing plate 1, and on the gluing table backing plate 1 1. An iron plate positioning column 3 is arranged between the two glass plate positioning columns 2, the number of the iron plate positioning columns 3 is two, and one side of the two iron plate positioning columns 3 protrudes from the On the side of the glass plate positioning column 2, the two glass plate positioning columns 2 are provided with a silicon block positioning column 4, and the two ends of the silicon block positioning column 4 are respe...
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Abstract
The invention relates to the technical field of semiconductors, in particular to an adhesive bonding device and an adhesive bonding method for silicon blocks. The adhesive bonding device comprises an adhesive bonding table base plate, the adhesive bonding table base plate is provided with two glass plate locating columns, iron plate locating columns are arranged between the two glass plate locating columns, a silicon block locating column is arranged on the two glass plate locating columns, threaded holes A are formed in the tops of the glass plate locating columns, strip-shaped holes extending in the width direction of the silicon block locating column are formed in the two ends of the silicon block locating column and communicate with the two threaded holes A in a one-to-one corresponding mode, butterfly bolts are arranged inside the strip-shaped holes and are connected to the threaded holes A in a threaded mode, the glass plate locating columns are provided with threaded holes B, and locating bolts B are arranged inside the threaded holes B. The adhesive bonding device and the adhesive bonding method have the beneficial effects that glass plates and the silicon blocks can be positioned in the adhesive bonding process, and adhesion deviation of the glass plates and the silicon blocks can be prevented.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a silicon block gluing device and a gluing method. Background technique [0002] The traditional gluing method needs to be glued to the glass plate and the silicon block at an interval of more than 30 minutes, and when the glass plate is glued, the glass plate is prone to sticking (the glass plate is not placed in the middle of the iron plate) phenomenon, resulting in abnormal cutting quality; the screw hole of each rod is 8 / 10 pieces, it takes 10 minutes / knife from installation to removal, and bolt slippage, untightened, forgetting to install, etc. often occur, resulting in serious quality loss. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a silicon block gluing device and gluing method, which can facilitate gluing in the process of gluing silicon blocks, and can effectively avoid quality problems caused by...
Claims
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IPC IPC(8): B28D7/04B28D5/00
CPCB28D7/04B28D5/0082
Inventor 周林覃奋飞
Owner CHONGQING DAQO NEW ENERGY