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Pressure Sensor Chip

A pressure sensor and sensor technology, applied in the direction of measuring fluid pressure, instruments, and pressure difference measurement between multiple valves, to achieve the effects of ensuring pressure resistance, reducing stress generation, and preventing diaphragm edge concentration

Active Publication Date: 2019-01-08
YAMATAKE HONEYWELL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the differential pressure sensor 100 has a configuration that protects the pressure sensor chip 1 from excessive pressure Pover by using the recesses 10a, 10b for restricting the displacement of the central diaphragm 6, barrier diaphragms 5a, 5b, its shape cannot be avoided. upsizing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0053] figure 1 It is a diagram showing the outline of the first embodiment (Embodiment 1) of the pressure sensor chip of the present invention.

[0054] exist figure 1 In the pressure sensor chip 11A shown, 11-1 is a sensor diaphragm, 11-2 and 11-3 are first and second stopper members as holding members bonded across the sensor diaphragm 11-1, and 11-4 and 11-5 are the 1st and 2nd bases joined to the stopper members 11-2 and 11-3. The blocking members 11-2, 11-3 and the bases 11-4, 11-5 are made of silicon, glass, or the like.

[0055] In this pressure sensor chip 11A, recessed portions 11-2a, 11-3a are respectively formed on the surfaces of the barrier members 11-2, 11-3 bonded to one surface and the other surface of the sensor diaphragm 11-1. The recessed portion 11-2a of the blocking member 11-2 is made to face one side of the sensor diaphragm 11-1, and the recessed portion 11-3a of the blocking member 11-3 is made to face the other face of the sensor diaphragm 11-1. ...

Embodiment approach 2

[0075] exist Figure 8 The outline of the second embodiment (Embodiment 2) of the pressure sensor chip of the present invention is shown in . Like the pressure sensor chip 11A of the first embodiment, the pressure sensor chip 11B of the second embodiment includes a non-joining area SA and an annular groove 11-2d continuous with the non-joining area SA inside the barrier member 11-2. , but differs from the pressure sensor chip 11A of Embodiment 1 in the following points.

[0076] In this pressure sensor chip 11B, the region S1 of the peripheral edge portion 11-2c of the barrier member 11-2 facing the sensor diaphragm 11-1 includes an outer peripheral region S1a and an inner peripheral region S1b. The region S1a on the outer peripheral side is a bonding region bonded to one surface of the sensor diaphragm 11-1, and the region S1b on the inner peripheral side is a non-bonding region not bonded to one surface of the sensor diaphragm 11-1.

[0077] In addition, a region S2 facing...

Embodiment approach 3

[0084] Figure 9 It is a diagram showing the outline of a third embodiment (Embodiment 3) of the pressure sensor chip of the present invention.

[0085] exist figure 1 , Figure 7 , Figure 8 In the example shown, the non-joint area SA is provided only inside the blocking member 11-2, but it may also be, for example, Figure 9 As shown as the pressure sensor chip 11C of the third embodiment, the non-joining area SA is also provided inside the stopper member 11-3, and the annular groove 11-3d is provided continuously to the non-joining area SA.

[0086] In the pressure sensor chip 11C according to Embodiment 3, the annular groove 11-2d provided inside the blocking member 11-2 and the annular groove 11-3d provided inside the blocking member 11-3 are set as The same cross-sectional shape is provided opposite to the same position, but the cross-sectional shape of the annular grooves 11-2d and 11-3d can be changed, and the lateral position of the annular grooves 11-2d and 11-3...

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PUM

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Abstract

A pressure sensor chip that includes a sensor diaphragm; and a first holding member and a second holding member bonded respectively to first surface and the second surface of the sensor diaphragm with peripheral portions thereof being positioned to face each other, each of the first holding member and the second holding member has a pressure introduction hole, the first holding member includes a non-bonding region formed inside the first holding member and communicating with a periphery of the pressure introduction hole, first and second grooves each has an annular shape formed in a peripheral edge portion of the non-bonding region, an end of the second groove is positioned closer to the pressure introduction hole than an end of the first groove, and the second holding member includes a recess.

Description

technical field [0001] The present invention relates to a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to a pressure difference between one side and the other side. For example, the present invention relates to forming a strain gauge on a thin plate-shaped diaphragm that is displaced by pressure, It is also a pressure sensor chip that detects the pressure applied to the diaphragm based on the change in the resistance value of the strain gauge formed on the diaphragm. Background technique [0002] Conventionally, as a differential pressure sensor for industrial use, a differential pressure sensor mounted with a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to a pressure difference received on one side and the other side has been used. [0003] This differential pressure sensor is configured to transmit the measured pressures applied to the pressure-receiving diaphragms on the high-pressure side and the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L19/06G01L13/02
CPCG01L19/0627G01L9/0051G01L13/025G01L19/0618
Inventor 濑户祐希
Owner YAMATAKE HONEYWELL CO LTD
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