Heat pipe for electronic wine cabinet and cold and heat generation device

Abstract

The invention discloses a heat pipe for an electronic wine cabinet. The heat pipe comprises a heat conduction block, a heat conduction pipe and a heat dissipation plate. A refrigerant is arranged in the heat conduction pipe. A cold and heat generation device comprises a shell with a front opening and a rear opening, and a foam separation medium is distilled water or purified water. The cold and heat generation device comprises the shell with the front opening and the rear opening, a foam partition plate, a semiconductor chilling plate, a heat insulation frame, the heat pipe, heat dissipation aluminum and a cover plate with a center hole. The heat dissipation aluminum comprises a cold conduction block, a base body and multiple cooling fins arranged on the base body. The heat pipe comprises the heat conduction block, the heat conduction pipe and the heat dissipation plate and further comprises the cover plate. The cover plate is buckled with the rear opening of the shell and presses the foam partition plate. The cover plate is fixedly connected with the shell through a screw. The heat conduction block is attached to the cover plate. The head portion of the heat conduction block penetrates the center hole of the cover plate to be attached to the semiconductor chilling plate. Due to the fact that the structure is adopted and the distilled water serves as the refrigerant in the heat conduction pipe, the characteristics that the distilled water has few impurities, no waste gas is discharged in the assembling process, and the heat conduction pipe is not corroded are given into full play, and the service life of the heat conduction pipe is prolonged.

Description

technical field [0001] The invention relates to a device for an electronic wine cabinet, in particular to a cold and heat generating device. Background technique [0002] At present, there is a cold and heat generating device for an electronic wine cabinet, which includes a shell with front and rear openings, a foam partition, a semiconductor refrigeration sheet, a heat insulation frame, a heat pipe, and heat dissipation aluminum. The heat dissipation aluminum includes a cold conducting block, a base body and Several cooling fins arranged on the substrate; the heat pipe includes a heat conduction block, a heat conduction pipe and a heat dissipation plate, and there is a refrigerant in the heat conduction pipe; there is an inner buckle plate in the front open end of the shell; there are steps at the front end of the foam partition, and the foam partition The center of the plate has a hole for the cold guide block; the heat insulation frame is set on the steps, the base is set...

AI Technical Summary

Problems solved by technology

Existing problems are: in the prior art, the refrigerant produces pollution during production or use, especially when assembling, the operator is equipped with protective equipment; and the heat pipe is corroded, which shortens the service life of the heat pipe

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