Novel Thermal Protection System for Powered Circuit Boards Including Fuses

A technology of electronic devices and electronic components, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc.

Inactive Publication Date: 2016-11-23
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such approaches work reasonably well, only a few of the prior art approaches that address refractory performance provide a multifaceted solution to the problem

Method used

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  • Novel Thermal Protection System for Powered Circuit Boards Including Fuses
  • Novel Thermal Protection System for Powered Circuit Boards Including Fuses
  • Novel Thermal Protection System for Powered Circuit Boards Including Fuses

Examples

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Embodiment Construction

[0010] Reference will now be made in detail to presently preferred compositions, examples and methods of the invention, which constitute the best modes of practicing the invention presently known to the inventors. The drawings are not necessarily drawn to scale, however, it is to be understood that the disclosed embodiments are merely exemplary embodiments of the invention, which may be embodied in various alternative forms. Therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for any aspect of the invention and / or as a training ground for teaching one skilled in the art to variously employ the present invention. representative basis.

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PUM

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Abstract

A coated electronic device that is fire resistant includes an electronic component and an intumescent layer disposed over the electronic component. The intumescent layer includes sodium silicate having formula Na2SiO3, pentaerythitol, a resin that is cross-linked by melamine, boron nitride particles, and triammonium phosphate.

Description

technical field [0001] In at least one aspect, the present invention relates to intumescent coatings for electronic components, and more particularly to intumescent coatings for circuit boards and fuses that may overheat and cause fires. Background technique [0002] Many electronic devices experience overheating which poses a certain risk of fire. For example, a short circuit in a device can generate a lot of heat. Inadvertent contact between an electronic component and water from a coolant leak or moisture buildup can cause this short circuit to occur. In addition, failed components may cause high electrical potentials, which can also cause fire or thermal runaway. [0003] Prior art approaches attempt to address fire risks in electronic devices in various ways. For example, electronics may be enclosed in a fire resistant enclosure. While such approaches work reasonably well, very few of the prior art approaches that address fire resistance provide a multifaceted solut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D167/00C09D167/08C09D163/00C09D133/00C09D5/18
CPCC08K3/32C08K3/34C08K3/38C08K5/053C08K5/34922C08K13/02C08K2003/322C08K2003/385C09D5/185C09D133/00C09D163/00C09D167/00C09D167/08H05K3/284H05K2201/012H05K2201/0209H05K2201/10181
Inventor H·K·福莱姆M·H·阿卜戴尔哈米德E·P·卡尔德龙S·A·赛德
Owner GM GLOBAL TECH OPERATIONS LLC
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