a lifting mechanism

Abstract

Embodiments of the present invention provide a lifting mechanism, which relates to the field of substrate carrying mechanical devices and can reduce the occurrence of electrostatic breakdown of the substrate to be processed during the lifting process. The lifting mechanism is used to carry the substrate to be processed, and includes a plurality of support rods. The support ends of the support rods are provided with support portions. The support portion is used to communicate with the substrate to be processed through the support surface of the support portion when the lifting mechanism carries the substrate to be processed. touch. The lifting mechanism also includes an ion wind supply device, and a through-passage channel is provided inside the support pole for transporting the ion wind output from the ion wind supply device into the channel of the support pole. An air outlet connected to the channel of the support rod is provided on the support portion at least on the support surface, and the ion wind delivered by the ion wind supply device is blown toward the substrate to be processed through the air outlet.

Description

technical field [0001] The invention relates to the field of substrate carrying mechanical devices, in particular to a lifting mechanism. Background technique [0002] In the production process of TFT-LCD (Thin Film Transistor Liquid Crystal Display, thin film transistor liquid crystal display), many processes need to place the substrate on the carrying platform of the lifting mechanism. In the process of moving and picking up the substrate to be processed, it needs to be operated by the support rod of the lifting mechanism. [0003] Lifting mechanism in the prior art, such as figure 1 As shown, a hard rubber end 021 is provided on the top of the pole 02, and the hard rubber end 021 can move up and down relative to the carrying platform 04 through the mounting hole b on the carrying platform 04. When the substrate 01 to be processed is transported to the carrying platform 04 When it is up, the poles 02 are raised from the corresponding mounting holes b to support the subst...

AI Technical Summary

Problems solved by technology

[0004] During the process of the substrate 01 to be processed, it is inevitable that there will be friction between the substrate 01 to be processed and the carrying platform 04, which will cause static electricity to be generated on the substrate 01 to be processed, especially when the support rod 02 pushes the substrate to be processed At the moment when 01 is separated from the carrying platform 04, since the end area of ​​the hard rubber end 021 of the support rod 02 is small and the material is relatively hard, the position in contact with the substrate 01 to be processed is prone to tip discharge, resulting in electrostatic breakdown, making The metal layer or ITO (Indium Tin Oxide, indium tin oxide) layer of the internal wiring of the substrate 01 to be processed is burned

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