Integral type observation cover plate used for semiconductor coating equipment

Abstract

The invention discloses an integral type observation cover plate used for semiconductor coating equipment. The observation cover plate is of an integral type transparent cover plate structure. The condition that the high-temperature technological process of an existing equipment reaction cavity is unobserved can be solved, and accurate positioning and interlocking trigger functions are added. The integral type observation cover plate structurally comprises a large cover plate, a plastic protection plate, a plastic spacer, a metal pressing plate, quartz glass, positioning blocks and the like. A seal ring A and a seal ring B are embedded in a seal groove of the large cover plate respectively, the quartz glass is arranged on the end face of the large cover plate in which the seal rings are embedded, the plastic spacer is arranged on the quartz glass, and the metal pressing plate is pressed on the plastic spacer. The positioning blocks are arranged on the horizontal single side and the vertical single side of the large cover plate, and finally the mounted cover plate structure is positioned in the horizontal and vertical directions of the reaction cavity through the positioning blocks, so that interlocking on the side edge of the reaction cavity can completely trigger an interlocking function through contact with the bottom end face of the large cover plate, and then normal-temperature film transferring or high-temperature film transferring technological process can be observed, or air exhaust leak detection is carried out on the cavity.

Description

technical field [0001] The invention relates to an integral observation cover plate structure for semiconductor coating equipment, which is mainly used in the normal temperature or high temperature process in the reaction chamber of the semiconductor coating equipment, and belongs to the application technical field of semiconductor thin film deposition. Background technique [0002] The existing semiconductor coating equipment is in a closed and invisible state in the reaction chamber when the film transfer process is carried out at room temperature or high temperature. When the cavity is observed, there will be some phenomena such as ceramic ring offset, ceramic bushing cracks, wafer fragmentation and film transfer failure, etc., and these phenomena occur in an invisible state. In order to better observe the process of these problems and find the root cause of the problem, a split transparent cover structure was designed to directly observe a series of phenomena in the reac...

AI Technical Summary

Problems solved by technology

However, for the two-chamber reaction module of the entire semiconductor equipment, the split cover plate is not accurately positioned. If the operator installs it a little bit, the cover plate cannot completely press the sealing ring and cause the entire vacuum system to leak; in addition During process deposition, the software interlock function on the reaction chamber cannot be triggered, which has potential safety hazards, so it is necessary to improve the design of the split cover plate

Images