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Forming method of heat sealing mold

A molding method and mold technology, used in household appliances, other household appliances, household components, etc., can solve the problems of unguaranteed bonding quality, unstable glue quality, limited drying process, etc., and achieve low cost of use and bonding. The effect of good strength and fast bonding speed

Active Publication Date: 2018-08-24
ZIBO QIYU AIRCONDITION ENERGY RECOVERY EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no special process for bonding at present, and manual operation is required, which has disadvantages such as low efficiency, unguaranteed bonding quality, unstable glue quality, and the drying process is limited by ambient temperature and humidity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:

[0022] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;

[0023] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;

[0024] C. Heating the upper mold to 210°C by electromagnetic induction;

[0025] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 0.9MPa, and the mold closing time is 1s;

[0026] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 110°C, and the cooling time is 1s;

[0027] F. The cylinder drives the upper mold to move upward to demould, to obtain the form...

Embodiment 2

[0030] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:

[0031] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;

[0032] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;

[0033] C. Heating the upper mold to 220°C by electromagnetic induction;

[0034] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 1.1MPa, and the mold closing time is 3s;

[0035] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 130°C, and the cooling time is 0.8s;

[0036] F. The cylinder drives the upper mold to move upward to demould, to obtain the fo...

Embodiment 3

[0039] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:

[0040] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;

[0041] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;

[0042] C. Heating the upper mold to 215°C by electromagnetic induction;

[0043] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 1MPa, and the mold closing time does not exceed 2s;

[0044] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 112°C, and the cooling time is 1s;

[0045] F. The cylinder drives the upper mold to move upward to demould, to obta...

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PUM

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Abstract

The invention belongs to the field of heat exchanger forming, and particularly relates to a heat seal die forming method. A heat seal die comprises an upper die body, a lower die body and a guide column facilitating matching of the upper die body and the lower die body. The heat seal die forming method comprises the following steps that A, a plastic framework is placed on the lower die body and positioned; B, the plastic framework is covered with an aluminum foil; C, the upper die body is heated to be at the temperature ranging from 210 DEG C to 220 DEG C; D, an air cylinder is used for driving the upper die body to extrude the lower die body, pressure is controlled to range from 0.9 MPa to 1.1 MPa, and the die assembly time does not exceed 3s; E, the temperature of the contact face of the upper die body and the aluminum foil is reduced to range from 110 DEG C to 130 DEG C, and the cooling time does not exceed 1s; and F, the air cylinder drives the upper die body to move upwards for die striping, and a formed heat seal piece is obtained. The heat seal die forming method adopting the technical scheme is high in bonding efficiency, and rapid drying can be achieved.

Description

technical field [0001] The invention belongs to the field of forming heat exchangers, and in particular relates to a forming method of a heat-sealing mold. Background technique [0002] A heat exchanger is a device that transfers part of the heat of a hot fluid to a cold fluid, and is often used as a heater, cooler, condenser, evaporator and reboiler. Heat exchangers are common equipment in chemical industry, petroleum, power, food and many other industrial sectors, and play an important role in production. The main part of the heat exchanger is the heat exchange fin. Multiple heat exchange fins of the same specification are stacked together. There are staggered fluid flow channels on the heat exchange fins. The cold fluid and the hot fluid pass through the adjacent flow channels respectively, and the hot fluid transfers the heat Transfer to cold fluid to realize heat exchange. [0003] In existing heat exchangers, the fluid passages in the heat exchange fins usually need ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/02B29L31/18
CPCB29C65/02B29C66/7422B29C66/91421B29C66/9241B29L2031/18
Inventor 李允征刘学张晓李红
Owner ZIBO QIYU AIRCONDITION ENERGY RECOVERY EQUIP