Forming method of heat sealing mold
A molding method and mold technology, used in household appliances, other household appliances, household components, etc., can solve the problems of unguaranteed bonding quality, unstable glue quality, limited drying process, etc., and achieve low cost of use and bonding. The effect of good strength and fast bonding speed
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Embodiment 1
[0021] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:
[0022] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;
[0023] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;
[0024] C. Heating the upper mold to 210°C by electromagnetic induction;
[0025] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 0.9MPa, and the mold closing time is 1s;
[0026] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 110°C, and the cooling time is 1s;
[0027] F. The cylinder drives the upper mold to move upward to demould, to obtain the form...
Embodiment 2
[0030] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:
[0031] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;
[0032] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;
[0033] C. Heating the upper mold to 220°C by electromagnetic induction;
[0034] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 1.1MPa, and the mold closing time is 3s;
[0035] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 130°C, and the cooling time is 0.8s;
[0036] F. The cylinder drives the upper mold to move upward to demould, to obtain the fo...
Embodiment 3
[0039] The invention provides a forming method of a heat-sealing mold, wherein the heat-sealing mold includes an upper mold and a lower mold, and a guide post for matching the upper mold and the lower mold. The mold is fixed, and the upper mold moves up and down through the cylinder. The process includes the following steps:
[0040] A. Place the ABS plastic frame on the lower mold and position it by positioning pins;
[0041] B. Cover the aluminum foil on the ABS plastic frame, and ensure the flatness of the aluminum foil;
[0042] C. Heating the upper mold to 215°C by electromagnetic induction;
[0043] D. Drive the upper mold to squeeze the lower mold through the cylinder, the pressure is controlled at 1MPa, and the mold closing time does not exceed 2s;
[0044] E. The temperature of the contact surface between the upper mold and the aluminum foil drops to 112°C, and the cooling time is 1s;
[0045] F. The cylinder drives the upper mold to move upward to demould, to obta...
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