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Thin film vector sensor and thin film deformation sensor

A vector sensor and film technology, applied in the field of sensors, can solve the problems of high circuit requirements, inability to detect the pressure vector direction, and low precision

Active Publication Date: 2016-12-07
苏州理欧电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Traditional MEMS sensors have very small changes in resistance value caused by angle changes, and have relatively high requirements on circuits; in addition, existing MEMS sensors have low precision and cannot detect the vector direction of pressure
In addition, the current robot cannot feel the pressure or the direction of the pressure because it does not have the sensor of the skin structure.

Method used

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  • Thin film vector sensor and thin film deformation sensor
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  • Thin film vector sensor and thin film deformation sensor

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the first film elastomer layer 11, the second film elastomer layer 21 and the third film elastomer layer 31 referred to in the present invention are all film elastomer layers, which themselves can be the same material, In the present invention, in order to facilitate the distinction of the thin film elastic body layer in the vector detection part 1 , the pressure detection part 2 and the thin film deformation sensor 3 , the above description method is adopted. Similarly, the same description method is adopted for the resistance elastic body layer, the wire layer and the conductive terminal.

[0031] Such as Figure 1 to Figure 3 As shown in , a thin film vector sensor according to the present invention includes a vector detection part 1, and the vector detection part 1 includes two layers of insulating first thin film ela...

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Abstract

The invention provides a thin film vector sensor and a thin film deformation sensor, and belongs to the technical field of sensors. The thin film vector sensor comprises a vector detection portion. The vector detection portion comprises two insulated first thin film elastomer layers. A first resistor elastomer layer and a first wire layer are arranged between the two first thin film elastomer layers. The first resistor elastomer layer is of a cross-shaped band structure. Four first conductive ends are arranged inside the first wire layer. The four first conductive ends are connected with four ends of the cross-shaped band structure in a one-to-one corresponding mode. According to the thin film vector sensor, pressure vector and pressure can be detected; the thin film vector sensor can be implanted into the skin structure of a robot, and the robot can sense the amplitude and direction of the pressure and other parameters. In addition, the thin film deformation sensor can be implanted into the human body, and the blood pressure and heart rate changing phenomenon can be recorded in real time.

Description

technical field [0001] The invention belongs to the field of sensors, in particular to a film vector sensor and a film deformation sensor. Background technique [0002] In traditional MEMS sensors, the change in resistance value caused by angle changes is very small, and the requirements on the circuit are relatively high; in addition, the existing MEMS sensors have low precision and cannot detect the vector direction of pressure. In addition, current robots cannot sense pressure or the direction of pressure because they do not have sensors for skin structure. Contents of the invention [0003] The technical problem solved by the invention is: to provide a thin film vector sensor capable of measuring the pressure direction; and a thin film deformation sensor capable of detecting deformation signals. [0004] The technical solution adopted by the present invention to solve the technical problem is: a thin film vector sensor, comprising a vector detection part, the vector d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22G01L5/16G01L9/00G01L9/04
CPCG01L1/2287G01L5/161G01L9/0052G01L9/04
Inventor 陈晓燕沈煜旻
Owner 苏州理欧电子科技有限公司