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Cooling apparatus and electronic device

A heat dissipation device and heat dissipation fin technology, applied in the field of electronics, can solve the problems of waste of metal sheets and the inability to fully exert the heat dissipation function of metal sheets

Active Publication Date: 2016-12-07
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat dissipation device is usually composed of a fan and heat dissipation fins. During the heat dissipation process, the heat conducted by different parts of the heat dissipation fins may be different. However, the existing heat dissipation fins are composed of multiple uniformly distributed metal Therefore, the heat dissipation function of metal sheets in different parts may not be fully utilized, resulting in waste of metal sheets

Method used

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  • Cooling apparatus and electronic device
  • Cooling apparatus and electronic device
  • Cooling apparatus and electronic device

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] The electronic equipment in the embodiment of the present invention can be different electronic equipment such as desktop computer, all-in-one machine, notebook computer, etc., and the embodiment of the present invention does not limit this, as long as it is an electronic equipment that needs to be dissipated by a cooling device, it can...

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Abstract

The invention discloses a cooling apparatus and an electronic device. The cooling apparatus is used for fully exerting a cooling function of a cooling fin to reduce material waste. The cooling apparatus comprises N fans and the cooling fin, wherein N is a positive integer; the cooling fin comprises at least one metal sheet and is arranged at air outlets of the N fans and used for cooling a heat source; air flow formed during working of the N fans passes through the cooling fin to achieve the effect of cooling the heat source; the distance between any two adjacent metal sheets arranged at a first part of the cooling fin is smaller than the distance between any two adjacent metal sheets arranged at a second part of the cooling fin; and the distance between the first part and the heat source is smaller than the distance between the second part and the heat source.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a heat dissipation device and electronic equipment. Background technique [0002] With the continuous development of science and technology, electronic technology has also developed rapidly, and there are more and more types and functions of electronic products, and people have also enjoyed various conveniences brought by the development of science and technology. Now people can enjoy the comfortable life brought by the development of science and technology through various types of electronic devices. For example, electronic devices such as desktop computers, all-in-one computers, and notebook computers have become an indispensable part of people's lives. Usually, these electronic devices generate heat during operation, which needs to be dissipated by a heat sink to ensure normal operation of the electronic devices. [0003] At present, the heat dissipation device is usuall...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 赵晶
Owner LENOVO (BEIJING) CO LTD