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Heat-conducting encapsulating material and application thereof

A technology for thermally conductive potting and potting materials, applied in the field of materials, can solve the problems of poor thermal conductivity, poor thermal conductivity, reduced reliability and life of electronic components, etc., and achieve high thermal conductivity, enhanced thermal conductivity, and enhanced compatibility. sexual effect

Active Publication Date: 2016-12-14
兆舜科技(广东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its products also have shortcomings, such as poor thermal conductivity, and the thermal conductivity is only about 0.2W / (m·k), which causes the heat generated by electronic equipment to be dissipated in time, reducing the reliability and life of electronic components.
However, its thermal conductivity is not good, and due to the presence of white carbon black, the potting compound has conductivity, which does not meet some potting requirements that require insulation.

Method used

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  • Heat-conducting encapsulating material and application thereof
  • Heat-conducting encapsulating material and application thereof
  • Heat-conducting encapsulating material and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A thermally conductive potting material, comprising the following components:

[0037]

[0038]

[0039] The preparation method of the heat-conducting potting material is:

[0040] Add the formulated amount of thermally conductive filler, treatment agent, diluent, and hydrogen-containing silicone oil to the formulated amount of vinyl silicone oil, heat up to 110°C to 130°C in a vacuum kneader and vacuum dehydrate for two hours, then cool to 30°C Next, add platinum catalyst and inhibitor and stir (vacuum degree 0.06-0.1MPa) evenly, degassing, and obtain heat-conducting potting material.

[0041] The viscosity of the thermally conductive potting material prepared in this example is 4800cs, the thermal conductivity is 1.6W, and the volume resistivity is 1.1×10 14 Ω·cm.

Embodiment 2

[0043] A heat-conducting potting material, said potting material comprises the following components in terms of 100 parts by weight of vinyl silicone oil:

[0044]

[0045] The preparation method of the heat-conducting potting material is:

[0046] Add the formulated amount of thermally conductive filler, treatment agent, diluent, and hydrogen-containing silicone oil to the formulated amount of vinyl silicone oil, heat up to 110°C to 130°C in a vacuum kneader and vacuum dehydrate for two hours, then cool to 30°C Next, add platinum catalyst and inhibitor and stir (vacuum degree 0.06-0.1MPa) evenly, degassing, and obtain heat-conducting potting material.

[0047] The viscosity of the thermally conductive potting material prepared in this example is 2500cs, the thermal conductivity is 1.9W, and the volume resistivity is 1.7×10 14 Ω·cm.

Embodiment 3

[0049] A heat-conducting potting material, said potting material comprises the following components in terms of 100 parts by weight of vinyl silicone oil:

[0050]

[0051] The preparation method of the heat-conducting potting material is:

[0052] Add the formulated amount of thermally conductive filler, treatment agent, diluent, and hydrogen-containing silicone oil to the formulated amount of vinyl silicone oil, heat up to 110°C to 130°C in a vacuum kneader and vacuum dehydrate for two hours, then cool to 30°C Next, add platinum catalyst and inhibitor and stir (vacuum degree 0.06-0.1MPa) evenly, degassing, and obtain heat-conducting potting material.

[0053] The thermal conductivity potting material prepared in this example has a viscosity of 3000cs, a thermal conductivity of 1.7W, and a volume resistivity of 1.6×10 14 Ω·cm.

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Abstract

The invention relates to a heat-conducting encapsulating material, comprising the following components, by 100 parts by weight of vinyl silicone oil: 100 parts by weight of the vinyl silicone oil, 500-800 parts by weight of heat-conducting filling material, 30-50 parts by weight of a treating agent, 9-30 parts by weight of hydrogenous silicone oil, 0.01-6 parts by weight of an inhibitor, 5-15 parts by weight of a diluent, 0.04-0.06 part by weight of platinum catalyst. By adding the suitable heat-conducting filling material, treating agent, hydrogenous silicone oil, inhibitor and platinum catalyst into the vinyl silicone oil, it is possible to impart low viscosity, high heat conductivity coefficient and large volume resistivity to the heat-conducting encapsulating material; particularly by adding the heat-conducting filling material, heat conductivity is enhanced, and by adding the treating agent, inter-component compatibility is enhanced and overall viscosity is reduced.

Description

technical field [0001] The invention belongs to the field of materials, and in particular relates to a heat-conducting potting material and its application. Background technique [0002] With the development of science and technology, electronic components and logic circuits tend to be denser and miniaturized, thus putting forward higher requirements for the stability of electrical appliances. Electronic potting materials usually use fluidity to impregnate into the gaps of electronic components, and form a protective layer that adheres well to electronic components after curing, and isolates electronic components from the outside world to a certain extent. The main function of electronic potting materials is to prevent moisture, dust and harmful gases from invading electronic components and semiconductor devices, reduce vibration, and prevent external forces from damaging electronic components. [0003] Commonly used electronic potting materials on the market mainly include...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/22C08K3/38C08K3/28C08K5/5425
CPCC08K2201/003C08K2201/014C08L83/04C08L2205/025C08K13/02C08K2003/2227C08K5/5425C08K2003/385
Inventor 黄永军陈军胡国新刘廷铸
Owner 兆舜科技(广东)有限公司