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A method for making circuit patterns of printed circuit boards based on magnetron sputtering technology

A printed circuit board and magnetron sputtering technology, which is applied in the fields of printed circuit, sputtering coating, and printed circuit manufacturing, can solve the problems that the copper-containing wastewater cannot be effectively reduced, so as to eliminate etching wastewater, improve adhesion, The effect of improving efficiency

Active Publication Date: 2019-01-22
SHENZHEN BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is still necessary to plate the entire insulating substrate with a metal layer, and then perform etching to obtain the circuit, which cannot effectively reduce the generation of copper-containing wastewater

Method used

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  • A method for making circuit patterns of printed circuit boards based on magnetron sputtering technology
  • A method for making circuit patterns of printed circuit boards based on magnetron sputtering technology
  • A method for making circuit patterns of printed circuit boards based on magnetron sputtering technology

Examples

Experimental program
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Effect test

Embodiment 1

[0025] This embodiment provides a method for making circuit patterns on a printed circuit board based on magnetron sputtering technology, comprising the following steps:

[0026] S1. Cover the isolation layer on the insulating substrate, and expose the area where the circuit needs to be formed;

[0027] S2. The first magnetron sputtering: vacuum magnetron sputtering metal to the insulating substrate under the protection of argon to form a metal layer;

[0028] S3. The second magnetron sputtering: Under the protection of argon gas, vacuum magnetron sputtering metal to the insulating substrate to thicken the metal layer;

[0029] S4. The isolation layer is removed, and the insulating base is electroplated to thicken the metal layer in the area where the circuit is formed.

[0030] In this embodiment, the insulating base is made of epoxy resin.

[0031] Further, the condition of the first magnetron sputtering is to first evacuate the vacuum chamber to a background vacuum degree...

Embodiment 2

[0039]This embodiment provides a method for making circuit patterns on a printed circuit board based on magnetron sputtering technology, comprising the following steps:

[0040] S1. Cover the isolation layer on the insulating substrate, and expose the area where the circuit needs to be formed;

[0041] S2. The first magnetron sputtering: vacuum magnetron sputtering metal to the insulating substrate under the protection of argon to form a metal layer;

[0042] S3. The second magnetron sputtering: Under the protection of argon gas, vacuum magnetron sputtering metal to the insulating substrate to thicken the metal layer;

[0043] S4. The isolation layer is removed, and the insulating base is electroplated to thicken the metal layer in the area where the circuit is formed.

[0044] In this embodiment, the insulating base is a ceramic base.

[0045] Further, the condition of the first magnetron sputtering is to first evacuate the vacuum chamber to a background vacuum degree of 4×...

Embodiment 3

[0053] This embodiment provides a method for making circuit patterns on a printed circuit board based on magnetron sputtering technology, comprising the following steps:

[0054] S1. Cover the isolation layer on the insulating substrate, and expose the area where the circuit needs to be formed;

[0055] S2. The first magnetron sputtering: vacuum magnetron sputtering metal to the insulating substrate under the protection of argon to form a metal layer;

[0056] S3. The second magnetron sputtering: Under the protection of argon gas, vacuum magnetron sputtering metal to the insulating substrate to thicken the metal layer;

[0057] S4. The isolation layer is removed, and the insulating base is electroplated to thicken the metal layer in the area where the circuit is formed.

[0058] In this embodiment, the insulating matrix is ​​a commercially available prepreg.

[0059] Further, the condition of the first magnetron sputtering is to first evacuate the vacuum chamber to a backgro...

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Abstract

The present invention discloses a printed wiring board circuit figure manufacturing method based on a magnetron sputtering technology. The method employs an isolation layer to shield a non-circuit area on an insulation matrix and expose an area required forming a line, the line is directly formed on the insulation matrix through magnetron sputtering and is thickened through electroplating to obtain a finished product. Because the line can be directly formed with no need for an etching operation, the printed wiring board circuit figure manufacturing method based on the magnetron sputtering technology can effectively improve the efficiency of the production of the circuit board, prevent from the generation of etching waste water and improve the environmentally friendly degree of the circuit board production industry while effectively reducing the consumption of raw metal.

Description

technical field [0001] The invention relates to a method for making circuit patterns of a printed circuit board, in particular to a method for making circuit patterns of a printed circuit board based on magnetron sputtering technology. Background technique [0002] Existing printed circuit boards (PCBs) generally use copper-clad laminates as raw materials. After thickening the copper layer and removing non-circuit parts by etching, the remaining copper forms circuits with certain functions. The above-mentioned etching process will remove more than 50% of the copper on the copper clad laminate, and the removed copper is often difficult to recycle and is directly discharged in the form of waste water, which not only causes a lot of waste of metal resources, but also causes serious damage to the waste water containing heavy metal ions. Environmental pollution restricts the development of circuit board manufacturing industry. [0003] Some people have applied physical vapor dep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/16C23C14/35C23C14/20C23C14/04C25D3/38C25D5/02
CPCC23C14/042C23C14/205C23C14/345C23C14/35C25D3/38C25D5/022H05K3/16H05K2203/104
Inventor 黄建国王强徐缓孙创涂祥运余光亮罗小忠
Owner SHENZHEN BOMIN ELECTRONICS