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Design method of ultrasonic elliptic vibration cutting device

A cutting device, elliptical vibration technology, applied in the direction of the drive device, fluid using vibration, feeding device, etc., can solve the problems of no description of design steps, no design method of ultrasonic elliptical vibration cutting device, etc.

Active Publication Date: 2016-12-21
SICHUAN UNIV
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Problems solved by technology

However, the piezoelectric ceramic sheets are arranged asymmetrically, and the design steps are also not explained
[0004] In summary, there is currently no design method for ultrasonic elliptical vibration cutting devices, and a complete introduction to the design steps of ultrasonic elliptical vibration cutting devices

Method used

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  • Design method of ultrasonic elliptic vibration cutting device
  • Design method of ultrasonic elliptic vibration cutting device
  • Design method of ultrasonic elliptic vibration cutting device

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Embodiment Construction

[0049] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto; any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention within the scope of protection.

[0050] Elliptical vibration cutting device, including: transducer 1, middle stage horn 2, final stage horn 3, first group (4 pieces) semi-circular piezoelectric ceramics 4, second group (4 pieces) semicircle The ring piezoelectric ceramic 5 is milled with a plane 6 at the end of the final horn.

[0051] (1) Determine the operating frequency of the device f =20KHz, transducer diameter d T =42mm, transducer and horn material density ρ T =, Young's modulus E T =, Poisson's ratio υ T =0.3, the diameter of the horn at all levels d 1 =36 mm, ...

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Abstract

The invention provides a design method of an ultrasonic elliptic vibration cutting device and belongs to the technical field of precise machining. The design method of the ultrasonic elliptic vibration cutting device comprises the following steps that firstly, the parameters of the ultrasonic elliptic vibration cutting device are determined; secondly, the length of an energy converter is calculated; thirdly, the positions where a wave loop and a wave node are located when the energy converter conducts bending vibration are calculated; fourthly, a piezoelectric ceramic piece is inserted, and the length of the energy converter is corrected; fifthly, the lengths of amplitude-change poles of all the levels are calculated; and sixthly, according to the shape of a cutter, a plane is milled at the tail end of the amplitude-change pole of the last level. According to the design method of the ultrasonic elliptic vibration cutting device, the cutter can generate elliptic movement path on a two-dimensional plane. In addition, in the design method, mathematical formula deduction is adopted, and empirical design and simulating optimization design are avoided.

Description

technical field [0001] The invention belongs to the technical field of precision machining, and in particular relates to a design method of an ultrasonic elliptical vibration cutting device. Background technique [0002] Ultrasonic elliptical vibration cutting was proposed by Japanese scholars Eiji Shamoto and others. When the diamond tool cuts hard and brittle materials and ferrous metals in a conventional way, the tool wear is very serious; but after applying ultrasonic elliptical vibration to the diamond tool to cut the above materials, the tool wear is significantly reduced, the service life of the diamond tool is extended, and the surface of the part is improved. Processing quality. [0003] At present, there are many patents for elliptical vibration cutting devices, including: patent (CN 103611947A) inventing a hinged parallel elliptical vibration cutting flexible device to realize diamond tools to generate elliptical trajectories. However, the device is a non-resona...

Claims

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Application Information

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IPC IPC(8): B23Q5/02B23Q5/22B06B1/06
CPCB06B1/06B23Q5/02B23Q5/22
Inventor 余德平黄玮海张敏姚进
Owner SICHUAN UNIV
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