Computer host shell with good heat dissipation performance

Abstract

The invention relates to a computer host shell with the good heat dissipation performance. The computer host shell comprises a wood host frame. The side walls of the two sides of the wood host frame are each provided with a lead glass side plate. A containing groove is formed in each lead glass side plate. An electrostatic precipitation device is arranged below each containing groove. A ventilation baffle is arranged below each electrostatic precipitation device. A heat absorption equipment groove is formed in one side of each ventilation baffle. A touch starting switch is arranged on the front end face of the wood host frame. A host output interface movable door is arranged on one side of the touch starting switch. A CD driver outlet movable door is arranged below the touch starting switch. The computer host shell is reasonable in structure and convenient to use, and due to the wood host frame, the appearance attractiveness of the host is improved; ventilation devices are arranged on a rear cover plate and the lead glass side plates of the wood host frame, heat dissipation and ventilation of the computer host shell are ensured; due to the fact that a copper graphene screen plate is arranged on the rear cover plate, electrostatic induction can be lowered, and dust adsorption can be avoided.

Description

technical field [0001] The invention relates to the technical field of computer mainframe equipment, in particular to a computer mainframe casing with good heat dissipation performance. Background technique [0002] At present, computers have become one of the necessary digital products for students and office workers. They can be used for office work, surfing the Internet and audio-visual entertainment, etc., greatly enriching people's spare time. However, the heat dissipation efficiency of the traditional computer mainframe shell is low, which can easily cause the temperature of the electronic components in the chassis to be too high, causing crashes, blue screens and other phenomena. It not only affects the operating experience, but also greatly reduces the service life of the computer. The heat dissipation effect is often poor due to the accumulation of a large amount of dust in the chassis, and the chassis is burned due to excessive temperature, and the function button...

AI Technical Summary

Problems solved by technology

However, the heat dissipation efficiency of the traditional computer mainframe shell is low, which can easily cause the temperature of the electronic components in the chassis to be too high, causing crashes, blue screens, etc.

Not only affects the operating experience, but also greatly reduces the service life of the computer

The heat dissipation effect is often poor due to the accumulation of a large amount of dust in the chassis, and the chassis is burned due to excessive temperature. Moreover, the function buttons and data interfaces of the existing electric energy host shell are often directly installed on the surface of the shell, and a large amount of heat will be absorbed by long-term use. dust, which affects the normal operation of the computer, the existing computer mainframe casing has the problems of difficulty in moving the mainframe and poor direction adjustment

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