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Chip welding pressure block assembly

A chip welding and block assembly technology, applied in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve the problems of affecting the pressure accuracy and welding effect, quantitative control of welding pressure, and long process realization cycle. Simple structure, high working stability and wide application range

Active Publication Date: 2017-01-04
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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AI Technical Summary

Problems solved by technology

[0005] One problem with the various briquette pressurization methods currently used is that, on the one hand, chips with different areas require different welding pressures, and the actual chip areas are different. Therefore, different products and different chips require different designs and processes. The same briquetting head leads to long process realization cycle, poor briquette versatility, low utilization rate, and high production cost; on the other hand, some pressurization methods cannot realize accurate quantitative control of welding pressure, thus affecting pressurization accuracy and welding effect

Method used

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Embodiment Construction

[0027] Such as Figure 1-6 As shown, a chip bonding compact assembly includes a group of compacts 1, each of which has the same bottom surface area and bottom shape, and the group of compacts 1 can be cylindrical or cubic or cuboid.

[0028] A tenon 1a is provided on the top of each pressing block 1, and a slot 1b corresponding to the tenon 1a is provided on the bottom of each pressing block 1. Threads are provided on the mortise 1a and the socket 1b, and several pressure blocks can be connected together through the threads so as to provide different pressures.

[0029] A stabilizer 2 is set, and the stabilizer 2 is composed of a frame body 4 and a group of frame legs 5, the frame body 4 includes a pair of channel steel 4a arranged in parallel, and the pair of channel steel 4a The notches are set relative to each other. On the channel wall on one side of the channel steel 4a, a group of vertically distributed locking bolts 4d are arranged along its length. The platen 4c. ...

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Abstract

The invention provides a chip welding pressure block assembly. The chip welding pressure block assembly is characterized by comprising at least one group of pressure blocks (1), wherein a tenon (1a) is arranged at the top of each pressure block (1); a slot (1b) which is correspondingly matched with each tenon (1a) is formed in the bottom of the corresponding pressure block (1); a stabilizing frame (2) is arranged; and at least one pressure block stabilizing ring (3) which is correspondingly matched with each pressure block (1) is arranged on the stabilizing frame (2). The chip welding pressure block assembly has the advantages of being simple in structure, convenient to use, low in manufacturing cost, wide in application range, high in working stability and the like, and accurate quantitative control on welding pressure can be achieved.

Description

[0001] Technical field: [0002] The invention designs a tool for chip welding, specifically a chip eutectic welding pressing block assembly. [0003] Background technique: [0004] Eutectic soldering is more and more used in the micro-assembly of integrated circuit chips. In order to obtain good soldering performance and chip flatness, the surface of the eutectic soldering chip needs to be properly pressurized. The main method is to apply welding on the chip surface by using a compact pressure. [0005] One problem with the various briquette pressurization methods currently used is that, on the one hand, chips with different areas require different welding pressures, and the actual chip areas are different. Therefore, different products and different chips require different designs and processes. The same briquetting head leads to long process realization period, poor briquette versatility, low utilization rate, and high production cost; on the other hand, some pressurization...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/603B23K37/00
CPCB23K37/00H01L21/50H01L24/741
Inventor 夏俊生李寿胜侯育增李波
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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