Circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a circuit board. The method comprises the steps that a substrate is provided, wherein the substrate comprises a substrate layer and a continuous first copper foil layer formed at one side of the substrate layer; a conductive layer is formed through electroplating in one part of area of the first copper foil layer; a surface treatment pattern is formed through electroplating on one part of surface of the conductive layer; the first copper foil layer which is not covered by the conductive layer is etched and removed, and meanwhile, the conductive layer which is not covered by the surface treatment pattern is thinned; and the left first copper foil layer on the surface of the substrate layer and the conductive layer become conductive line patterns to obtain the circuit board free of an electroplating wire. The invention further relates to the circuit board, obtained by the manufacturing method, free of the electroplating wire.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof. Background technique [0002] Generally speaking, in order to perform surface treatment on the solder pad area exposed in the solder mask opening after the solder mask is formed, the solder pad will be connected to some lines extending outward to the edge area of ​​the board. For signal transmission, it is only used as an electrical connection pad to be able to plate metal on the pad, so it is generally called a plating wire. In the final product, the plating wire covered by the solder mask will not be removed and will remain in the solder mask. Layer, this part of the remaining plating wire will have an adverse effect on signal transmission. In addition, the electroplated wires in the gold finger area are thinner and adjacent to the terminals. After repeated plugging and unplugging operations, the electroplated wires are prone to friction or bending with external mechanisms,...

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, in order to perform surface treatment on the solder pad area exposed in the solder mask opening after the solder mask is formed, the solder pad will be connected to some lines extending outward to the edge area of ​​the board. For signal transmission, it is only used as an electrical connection pad to be able to plate metal on the pad, so it is generally called a plating wire. In the final product, the plating wire covered by the solder mask will not be removed and will remain in the solder mask. Layer, this part of the remaining plating wire will have an adverse effect on signal transmission

In addition, the electroplated wires in the gold finger area are thin and adjacent to the terminals. After repeated plugging and unplugging operations, the electroplated wires are prone to friction or bending with external mechanisms, and the flex resistance is poor.

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