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Circuit board and method of making the same

A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of friction or bending of electroplated wires, poor bending resistance, adverse effects of signal transmission, etc., to ensure electrical quality. , Improve the wiring space and facilitate the effect of thin circuit design

Active Publication Date: 2019-06-11
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, in order to perform surface treatment on the solder pad area exposed in the solder mask opening after the solder mask is formed, the solder pad will be connected to some lines extending outward to the edge area of ​​the board. For signal transmission, it is only used as an electrical connection pad to be able to plate metal on the pad, so it is generally called a plating wire. In the final product, the plating wire covered by the solder mask will not be removed and will remain in the solder mask. Layer, this part of the remaining plating wire will have an adverse effect on signal transmission
In addition, the electroplated wires in the gold finger area are thin and adjacent to the terminals. After repeated plugging and unplugging operations, the electroplated wires are prone to friction or bending with external mechanisms, and the flex resistance is poor.

Method used

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  • Circuit board and method of making the same
  • Circuit board and method of making the same
  • Circuit board and method of making the same

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Embodiment Construction

[0042] An embodiment of the present invention provides a method for manufacturing a circuit board 10, comprising steps:

[0043] For a first step, see figure 1 , providing a substrate 11 comprising a base layer 110 and a continuous first copper foil layer 111 and a continuous second copper foil layer 112 formed on two opposite surfaces of the base layer 110 .

[0044] In this embodiment, the base layer 110 is a flexible resin layer, such as polyimide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or polyethylene naphthalate (Polythylene Naphthalate, PEN); In other embodiments, the base layer 110 may also be a multi-layer flexible substrate, including multiple resin layers and multiple conductive circuit layers arranged alternately. The thickness of the first copper foil layer 111 and the second copper foil layer 112 is uniform. In this embodiment, the thickness of the first copper foil layer 111 and the second copper foil layer 112 is the same. ...

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Abstract

The present disclosure relates to a method for manufacturing a printed circuit board. The method includes the steps as follows. First, a substrate including a base layer and a copper foil layer on a surface of the base layer is provided. Second, a conductive layer is formed on portions of the copper foil layer. Third, portions of the copper foil layer exposed from the conductive layer are removed by an etching process, and the conductive layer is thinner by the etching process. The reserved portions of the copper foil layer and the conductive layer form a conductive pattern to obtain a printed circuit board without plating wires. A printed circuit board without plating wires made by the above method is also provided.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof. Background technique [0002] Generally speaking, in order to perform surface treatment on the solder pad area exposed in the solder mask opening after the solder mask is formed, the solder pad will be connected to some lines extending outward to the edge area of ​​the board. For signal transmission, it is only used as an electrical connection pad to be able to plate metal on the pad, so it is generally called a plating wire. In the final product, the plating wire covered by the solder mask will not be removed and will remain in the solder mask. Layer, this part of the remaining plating wire will have an adverse effect on signal transmission. In addition, the electroplated wires in the gold finger area are thinner and adjacent to the terminals. After repeated plugging and unplugging operations, the electroplated wires are prone to friction or bending with external mechanisms,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/28
CPCH05K3/244H05K3/108H05K3/427H05K2201/0154H05K2201/0338H05K2201/09736H05K2201/098H05K2203/0723H05K2203/1394
Inventor 苏威硕
Owner AVARY HLDG (SHENZHEN) CO LTD
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