a sensor base
A sensor and base technology, applied in the field of sensors, can solve the problems of high precision requirements, cannot be used as a pressure sensor base alone, and cannot be extended, and achieves the effects of flexible packaging, high production efficiency, and prevention of condensation.
Active Publication Date: 2022-07-22
SHANGHAI LEEG INSTR CO LTD
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Problems solved by technology
[0002] The currently used pressure / differential pressure sensor package base has the following defects: 1, 2 or less oil-filled tubes (holes), only one or two sensors can be packaged, and only one of the two sensors can be vented to the atmosphere ( Gauge pressure), the actual use is limited in the occasions with high precision requirements; 2. It can only be used for differential pressure sensors with diaphragm boxes, and the traditional pressure packaging process cannot be extended: the fast resistance welding sealing process cannot be used for pressure alone sensor base
Method used
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Embodiment Construction
[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] like Figure 1-4 As shown, as an embodiment of the present invention, the sensor base includes a base body 1, a lateral passage 8, a first connecting pipe 3 and a second connecting pipe 4, and one end of the first connecting pipe 3 is inserted into In the base body 1, the other end is exposed on one end surface of the base body 1, and the other end surface of the base body 1 communicates with one end of the first connecting pipe 3 through the first passage 9; the second connection One end of the pipe 4 is inserted into the base body 1 , the other end is exposed on one end surface of the base body 1 , and the other end surface of the base body 1 communicates with one end of the second connecting pipe 4 through the second passage 10 The base body 1 is provided with a third passage 11 and a fourth passage 12, one end of the third p...
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The invention discloses a sensor base, comprising a base body, a lateral passage, a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is inserted into the base body, and the other end is exposed on the base. One end face of the base body, the other end face of the base body and one end of the first connecting pipe are communicated through a first passage; one end of the second connecting pipe is inserted into the base body, and the other end is exposed to the base. One end surface of the seat body and the other end surface of the base body communicate with one end of the second connecting pipe through a second passage. The sensor base provided by the present invention can encapsulate a variety of sensors, multiple sensors, and can independently form a composite parameter sensor without the cooperation of other bellows parts, the base body can communicate with the atmosphere through multiple channels, and the sensor and the base body An oil-filled cavity is arranged between the sensor, and a circuit board is arranged on the rear side of the sensor.
Description
technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a multi-chip porous sensor base. Background technique [0002] The currently used pressure / differential pressure sensor package base has the following defects: 1, 2 or less than 2 oil-filled pipes (holes), only one or two sensors can be packaged, and only one of the two sensors can be vented to the atmosphere ( In the case of high precision requirements, the actual use is limited; 2. It can only be used for differential pressure sensors with bellows, and the traditional pressure packaging process cannot be extended: the rapid resistance welding sealing process cannot be used for pressure alone. sensor base. SUMMARY OF THE INVENTION [0003] In view of the deficiencies of the prior art, the purpose of the present invention is to provide a sensor base to improve its application range. [0004] In order to achieve the above purpose, the sensor base provided by the pr...
Claims
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IPC IPC(8): G01L19/00
CPCG01L19/0007
Inventor 陈文弦桂永波黄龙圣
Owner SHANGHAI LEEG INSTR CO LTD