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liquid encapsulated chip

A technology for liquid encapsulation and encapsulation, which is used in measuring devices, instruments, scientific instruments, etc., and can solve problems such as unusable devices, unaligned windows, and unusable encapsulation devices.

Active Publication Date: 2018-11-16
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the window size of the silicon nitride film is very small, due to preparation and operation errors, the two silicon nitride film windows are very easy to shift relative to each other and cannot be aligned, which makes it impossible for electron beams and X-rays to pass through at the same time. Two viewing windows, making the encapsulated device unusable
In addition, the space of the liquid sealed compartment formed between the two silicon wafers is very small, and the amount of stored liquid samples is very small, which is easy to volatilize and dry during the process of making observation samples, which will also make the packaging device unusable

Method used

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Embodiment Construction

[0030] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0031] In the present invention, unless otherwise specified, the orientation words used such as "upper and lower" usually refer to the relative orientation of the liquid-encapsulated chips when they are placed horizontally.

[0032] The present invention provides a liquid encapsulation chip, comprising an upper encapsulation sheet 1 and a lower encapsulation sheet 2, wherein the periphery of the lower encapsulation sheet 2 is formed with an upwardly protruding circumferential surrounding wall 24, and the circumferential enclosing wall 24 The upper surface of the upper packaging sheet 1 is formed as a first inclined surface inclined inwardly and downwards, the lo...

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Abstract

The invention discloses a liquid packaging chip. The liquid packaging chip comprises an upper-layer packaging wafer (1) and a lower-layer packaging wafer (2). A circumferential surrounding wall (24) protruding upwards is formed on the peripheral edge of the lower-layer packaging wafer (2), the upper surface of the circumferential surrounding wall (24) forms a first inclined surface, the lower surface of the upper-layer packaging wafer (1) forms a second inclined surface, the upper-layer packaging wafer (1) is arranged on the lower-layer packaging wafer (2), the first inclined surface and the second inclined surface are attached to each other in a sealed mode, and a sealed liquid storage space is formed between the upper-layer packaging wafer (1) and the lower-layer packaging wafer (2). The upper-layer packaging wafer and the lower-layer packaging wafer which are connected in a sealed mode through the inclined face structures can be automatically aligned, and thus a good sealing effect can be achieved; besides, the liquid storage space formed by the circumferential surrounding wall in a surrounding mode is large and can contain a large quantity of liquid samples, and thus it is avoided that as the quantity of liquid samples is too small, drying occurs, and consequently an assembled liquid packaging chip can not be used.

Description

technical field [0001] The invention relates to a device for in-situ observation of a liquid-phase sample by a high-vacuum instrument, in particular to a liquid-encapsulated chip. Background technique [0002] With the rapid development of nanotechnology, electron microscopes, X-ray energy spectrometers and other instruments have become the main means of analyzing nano-scale microstructures and components. These instruments use electron beams, X-rays, etc. as light sources. interaction to obtain information on the microstructure and composition of the sample, and these instruments need to work in a high vacuum environment (usually the vacuum in the sample chamber is higher than 10 -4 Pa), correspondingly, this requires that the sample under observation is dry and free from volatiles. However, many samples have different structures between the liquid phase and the solid phase (after drying), such as the self-assembled structure of molecules such as vesicles in the liquid pha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/04
CPCG01N23/04G01N2223/03G01N2223/30
Inventor 关波岳纪玲李祥梁丽荣尚海平
Owner INST OF CHEM CHINESE ACAD OF SCI