Ceramic chip leveling heat treatment tool and heat treatment process thereof

Abstract

The present invention relates to a ceramic chip leveling heat treatment tool and a heat treatment process thereof, and relates to the technical field of ceramic chip heat treatment, which mainly aims to improve the qualified rate of products and lower the production cost. The ceramic chip leveling heat treatment process comprises the steps of placing a to-be-leveled ceramic chip into an accommodating groove, pressing the lower end surface of a pressing cover onto the to-be-leveled ceramic chip through an opening of the accommodating groove so as to load the to-be-leveled ceramic chip into the ceramic chip leveling heat treatment tool, and applying a pressure by adopting a counterweight block; transferring the tool with the to-be-leveled ceramic chip arranged therein into a heat treatment furnace for heat treatment so as to deform and level the to-be-leveled ceramic chip; cooling the tool with the to-be-leveled ceramic chip arranged therein so as to obtain a ceramic chip finished product. in this way, the ceramic chip, which is deformed and warped after the sintering treatment or the surface treatment, is leveled, so that usage requirements can be met. Meanwhile, the product qualified rate of ceramic chips is improved.

Description

technical field [0001] The invention relates to the technical field of heat treatment of sheet ceramics, in particular to a flattening heat treatment tool and heat treatment process of sheet ceramics. Background technique [0002] Sheet ceramics are the substrates for preparing ceramic substrates. Ceramic substrates made of sheet ceramics have excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can be used like printed circuit boards PCB It can also etch various patterns and has a large current-carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] At present, the lamination sintering method is generally used in the processing technology of sheet ceramics. A certain number of ceramic sheets to be sintered are stacked and then sintered. The material properties of the sheet ce...

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Problems solved by technology

[0005] During sintering, the ceramic sheets to be sintered will undergo large or small deformations, especially the warping and deformation of the ceramic sheets to be sintered on the upper part of the laminated layer is the most serious, and they are often disposed of as waste products, which affects the product qualification rate and production cycle. caused a certain degree of waste of resources

[0006] In addition, in order to meet the requirements of the circuit on the surface roughness of the sheet ceramics, surface treatment such as grinding and polishing is required after the ceramics are sintered. Due to the influence of grinding and polishing stress, the sheet ceramics will have a certain degree of warping deformation after grinding and polishing. Lead to lower product yield

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