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Flame-retardant polyamide-based thermally conductive material and its preparation method and its application in the preparation of LED heat dissipation plastics

A polyamide-based, thermally conductive material technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problem that the mechanical properties of thermally conductive fillers and flame retardant materials are not very helpful, and is conducive to market promotion. The effect of utilization, high heat distortion temperature, excellent performance

Active Publication Date: 2018-11-09
CGN JUNER NEW MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method solves the flame retardant problem of existing thermally conductive plastics, but in this paper, graphite filling is mainly used to improve the thermal conductivity of the material, which is biased towards thermally and electrically conductive materials, and the blending of thermally conductive fillers and flame retardants does not greatly help the mechanical properties of the material

Method used

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  • Flame-retardant polyamide-based thermally conductive material and its preparation method and its application in the preparation of LED heat dissipation plastics
  • Flame-retardant polyamide-based thermally conductive material and its preparation method and its application in the preparation of LED heat dissipation plastics
  • Flame-retardant polyamide-based thermally conductive material and its preparation method and its application in the preparation of LED heat dissipation plastics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The flame-retardant polyamide-based thermally conductive plastic includes the following components in parts by mass: 50 parts of medium-viscosity PA6 (Bayer B29HM01, Germany) and 10 parts of low-viscosity PA6 (BASF B3EG6), 110 parts of magnesium hydroxide (crystalline Type, the particle size is 2μm, purity ≥ 98%), 20 parts of continuous long glass fiber (Jushi glass fiber 988A), 3.5 parts of maleic anhydride grafted POE (ExxonMobil 0812HT), 10 parts of titanium dioxide, 0.6 parts Antioxidant 168, 0.6 part of antioxidant 1098, 1.25 part of lubricant silicone powder, 0.4 part of lubricant EBS, 0.4 part of silicone oil; the preparation method of this flame-retardant polyamide-based heat-conducting plastic is as follows: (1) material premixing

[0035] Weigh 1000g of medium-viscosity PA6, 200g of low-viscosity PA6, 8g of silicone oil, and 70g of maleic anhydride-grafted POE, and add them to a low-speed heated mixer, stir evenly at a speed of 50-100rpm, and then stir them in ...

Embodiment 2

[0039]The flame-retardant polyamide-based thermally conductive plastic includes the following components in parts by mass: 45 parts of medium-viscosity PA6 (Bayer B29HM01, Germany) and 10 parts of low-viscosity PA6 (BASF B3EG6), 110 parts of magnesium hydroxide (crystalline type, the particle size is 2μm, purity ≥ 98%), 20 parts of continuous long glass fiber (Jushi glass fiber 988A), 3.5 parts of maleic anhydride grafted POE (ExxonMobil 0812HT), 20 parts of zinc oxide, 0.6 Part of antioxidant 412s, 0.6 part of antioxidant 1098, 1.25 part of lubricant silicone powder, 0.4 part of lubricant EBS, 0.4 part of silane coupling agent KH550; the preparation method of this flame-retardant polyamide-based thermally conductive plastic is as follows:

[0040] (1) Material premixing

[0041] Weigh 900g of medium-viscosity PA6 and 200g of low-viscosity PA6, 8g of silane coupling agent KH550, and 70g of maleic anhydride grafted POE, and add them to a low-speed heating mixer, stir evenly at ...

Embodiment 3

[0045] The flame-retardant polyamide-based thermally conductive plastic includes the following components in parts by mass: 45 parts of medium-viscosity PA6 (Bayer B29HM01, Germany) and 10 parts of low-viscosity PA6 (BASF B3EG6), 110 parts of magnesium hydroxide (crystalline Type, the particle size is 2μm, purity ≥ 98%), 20 parts of continuous long glass fiber (Jushi glass fiber 988A), 3.5 parts of maleic anhydride grafted POE (ExxonMobil 0812HT), 20 parts of boron nitride, 0.6 parts of antioxidant 412s (pentaerythritol tetrakis (3-lauryl thiopropionate)), 0.6 parts of antioxidant 1098, 1.25 parts of lubricant silicone powder, 0.4 parts of lubricant EBS, 0.4 parts of silane coupling agent KH550 ; The preparation method of the flame-retardant polyamide-based thermally conductive plastic is as follows:

[0046] (1) Material premixing

[0047] Weigh 900g of medium-viscosity PA6 and 200g of low-viscosity PA6, 8g of silane coupling agent KH550, and 70g of maleic anhydride grafted ...

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Abstract

The invention discloses a flame retardant polyamide-based heat-conducting material and a preparation method thereof and application thereof in preparing a plastic for LED head dissipation. The material is composed of the following components in part by weight: 45-100 parts of polyamide resin, 75-140 parts of heat-conducting filler, 5-25 parts of glass fiber, 0-5 parts of toughening agent, 0.2-5 parts of lubricant, 0.75-3 parts of antioxidant, and 0.25-1 part of surface treating agent; the heat-conducting filler is composed of heat-conducting main filler magnesium hydroxide and heat-conducting auxiliary filler in weight ratio of 110 to (5 to 30), wherein the heat-conducting auxiliary filler is one or not less than two of zinc oxide, boron nitride, aluminum nitride, and titanium dioxide. The method disclosed by the invention has excellent heat conducting property, flame retardant property and mechanical property, and high thermal deformation temperature, and is extremely suitable for the preparation of the plastic for LED heat dissipation. By use of a double-screw extruder, the method disclosed by the invention is simple in preparation and liable in the industrial production.

Description

technical field [0001] The invention relates to the technical field of polyamide heat-conducting materials, in particular to a flame-retardant polyamide-based heat-conducting material, a preparation method thereof, and an application in preparing plastics for heat dissipation of LEDs. Background technique [0002] Light-emitting diode ("LED" for short), because of its advantages of environmental protection, energy saving and high efficiency, has been widely used in the industrial field, and is called a kind of green "solid-state lighting". With the advent of Industry 4.0, LED is gradually developing in the direction of lightweight and multi-functional. However, it also brings about the problem of poor heat dissipation, which greatly affects the service life of the LED chip. In order to make the chip work normally with high reliability, heat-conducting materials with high heat dissipation performance have become an indispensable key link in LED design. Traditional thermal c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/02C08L51/06C08K13/04C08K7/14C08K3/22C09K5/14B29C47/92B29C48/92
CPCB29C48/92B29C2948/9258B29C2948/92704C08L77/02C08L2201/02C08L2201/08C08L2203/20C08L2205/025C08L2205/035C09K5/14C08L51/06C08K13/04C08K7/14C08K2003/2224C08K2003/2241C08K2003/2296C08K2003/385
Inventor 郑友明陈晓敏黄志杰郑京连田际波方万漂
Owner CGN JUNER NEW MATERIALS