Laser through cutting device and method for transparent hard and brittle material

Abstract

The invention relates to the technical field of laser cutting and discloses a laser through cutting device for a transparent hard and brittle material. The laser through cutting device for the transparent hard and brittle material comprises a laser device, a beam expander, a reflector, an extended depth of focus optical device and a focusing mirror. The laser device receives an external pulse signal and forms a pulse envelope. The pulse envelope is subjected to beam expanding through the beam expander, is reflected by the reflector and then sequentially passes through the extended depth of focus optical device and the focusing mirror to form a laser spot. The focusing spot acts on the machined material to form a material modification channel or a material modification channel cluster penetrating through the material in the thickness direction. The laser through cutting device for the transparent hard and brittle material guarantees that the machined material can crack along a preset path, efficient and precise cutting of the machined material is achieved, and the requirements for high efficiency, high quality and a low damage threshold are met.

Description

technical field [0001] The present invention relates to the technical field of laser cutting, and more specifically relates to a laser through-cutting device and cutting method for transparent hard and brittle materials, generally involving through-cutting such as glass, sapphire, and transparent ceramics. Background technique [0002] Chemically strengthened glass is widely used in consumer electronics due to its excellent strength and damage resistance. Strengthened glass is the material of choice for cover materials for cell phones, tablets, computer displays, and other LCD and LED displays. Chemically strengthened glass has surfaces that are under pressure and interior regions that are under tension. Elastic energy proportional to the square of the central tension is stored in this central stretch zone. Corning Gorilla Glass can have a surface pressure greater than 750MPa and a compression layer depth greater than 40μm. High surface pressure and deep surface compressi...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problems existing in the prior art, and provide a laser penetration cutting device and cutting method for transparent hard and brittle materials, which can solve the defects existing in the existing processing methods and meet the requirements of high efficiency, high quality and low damage. Threshold requirements

Images