Method for quickly printing microstrip pieces

Abstract

The invention relates to a method for quickly printing microstrip pieces. The method includes the following steps: (1) picking out a steel sheet of an appropriate size according to the quantity of the microstrip pieces to be printed; (2) drilling through holes in the steel sheet by using a laser machine; (3) connecting an appropriate quantity of microstrip pieces in a sticking mode by using an ultraviolet exposure film; (4) fixing the microstrip pieces by using the steel sheet which is provided with the through holes; (5) coating the microstrip pieces by using the mode of silk-screen printing; and (6) after coating is completed, exposing the ultraviolet exposure film on the lower layers of the microstrip pieces through an ultraviolet exposure machine, and then taking out the coated microstrip pieces. In the method for quickly printing the microstrip pieces, by utilizing a mature laser drilling technology and a silk-screen printing technology, a locating clamp used when the microstrip pieces are coated is prepared, so that the problem that a plurality of microstrip pieces cannot be coated at the same time at present is solved, quick coating of the microstrip pieces is achieved, the manufacturing cost of the clamp is lowered and the coating efficiency on the microstrip pieces is improved. Furthermore, the method is simple, the cost is low, the feasibility is high, and the application range is wide.

Description

technical field [0001] The invention relates to a glue coating method for electronic components, in particular to a method for rapidly printing microstrip sheets. Background technique [0002] Radar microwave components involve the assembly of components on the substrate, mainly including microstrip chip assembly, chip assembly, and chip component assembly represented by chip capacitors. The bonding process of components such as microstrip chips must meet the heat dissipation and environmental requirements. At present, there are two main assembly methods for such components: conductive adhesive bonding and solder bonding. [0003] With the development of miniaturization and portability of electronic products and the continuous improvement of device integration, the traditional Pb / Sn solder can no longer meet the process requirements. Conductive adhesive can play the role of circuit connection and mechanical connection, and has many advantages at the same time, such as envir...

AI Technical Summary

Problems solved by technology

It takes a lot of time to assemble by using the commonly used method of manual coating of conductive adhesive, and the consistency of coating is not good; when coating by screen printing, although it can solve the problem of poor consistency of coated conductive adhesive, However, since the microstrip sheets in microwave components are separated one by one, the fixation of the microstrip sheets during coating affects the rate of conductive adhesive coating

Therefore, it is urgent to find a simple way to solve the problem of slow brushing rate of microstrip film

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