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Resin composition for mold cleaning

A resin composition and mold technology, applied in the direction of zinc organic compounds, etc., can solve the problems of attached pollutants, peeling of sealing molding materials, etc., and achieve the effect of improving workability and good mold cleaning performance

Active Publication Date: 2020-08-14
NIPPON CARBIDE KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If such contaminants remain on the inner surface of the molding die, there will be a problem that the contaminants will adhere to the surface of the sealing molded product such as an integrated circuit or an LED element, or the sealing molding material will not be peeled off from the molding die.

Method used

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  • Resin composition for mold cleaning

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0093] [Preparation method of resin composition]

[0094] The resin composition of the present invention can be used, for example, by using a kneader, ribbon mixer, Henschel mixer, ball mill, roll mill, grinding machine, drum ( tumbler) etc., the melamine-based resin, the metal soap, the fibrous inorganic compound, the softwood pulp, and other additives used as needed are mixed substantially uniformly to prepare.

[0095] [How to use the resin composition]

[0096] The resin composition for mold cleaning of the present invention is suitable for a transfer type mold cleaning resin composition used in a transfer molding machine.

[0097] The resin composition of the present invention is usually processed into a sheet shape and used for cleaning operations on the inner surface of a molding die (inside the molding die). Specifically, in the cleaning operation, after arranging the lead frame on the forming die, the sheet-shaped resin composition is inserted into the pot portion. After cl...

Embodiment

[0104] Hereinafter, the present invention will be specifically explained through examples, but the present invention is not limited to the following examples as long as it does not exceed the gist.

[0105] [Preparation of melamine resin containing softwood pulp and melamine-formaldehyde resin]

manufacture example 1

[0107] 480 parts by mass of melamine and 522 parts by mass of formaldehyde (37% by mass aqueous solution) were heated to produce a melamine-formaldehyde resin by a known method, and softwood pulp (trade name by Nippon Paper Co., Ltd.) was added to the obtained resin solution. NSPP1) 248 parts by mass and kneaded, dried under reduced pressure and powdered to obtain a softwood pulp-containing melamine-formaldehyde resin.

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Abstract

A mold cleaning resin composition comprising a melamine-based resin, a metal soap, a fibrous inorganic compound, and softwood pulp, wherein the content of the metal soap is 1.6 parts by mass or more with respect to 100 parts by mass of the resin composition for mold cleaning And 5.0 parts by mass or less.

Description

Technical field [0001] The present invention relates to a resin composition for mold cleaning. Background technique [0002] In the case of sealing and molding using a sealing molding material containing a thermosetting resin composition, when the sealing and molding operations of integrated circuits, LED elements, etc. are continued for a long time, contaminants (dirt) derived from the sealing molding material are likely to adhere to the molding On the inner surface of the mold. When such contaminants remain on the inner surface of the molding die, there is a problem that contaminants adhere to the surface of the sealed molded product such as integrated circuits and LED elements, or the sealing molding material cannot be peeled from the molding die. Therefore, in the case of seal molding, it is required to remove contaminants present on the inner surface of the molding die. Specifically, in the case of seal molding, it is desirable to mold the resin composition for mold cleani...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/20C08L61/28C08L61/34C08L97/02C08K13/04C08K7/08C08K5/098C08K3/36
CPCC08L61/20C08L2205/16C08L2205/03C08L61/28C08L97/02C08K13/04C08K7/08C08K5/098C08K3/36C08L61/34B29C33/722C07F3/06C08K5/09C08K7/02C08K7/04
Inventor 福西阳一吉村胜则野村弘明弘光清人
Owner NIPPON CARBIDE KOGYO KK