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A resistance measuring probe

A resistance and measurement technology, applied in the measurement of electrical variables, resistance/reactance/impedance, components of electrical measuring instruments, etc., can solve short circuits, not suitable for poly wafer surface resistance, probe 2 is easy to fully penetrate, etc. problems, to ensure accuracy, prevent short circuits, and avoid contact

Active Publication Date: 2020-08-25
WUHAN XINXIN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] figure 2 It is a schematic diagram of measuring the surface resistance of the polychip in the background technology of the present invention. As shown in the figure, the polychip 4 needs to be placed on a hard plate 5 before measurement. Because the surface of the polychip 4 is soft, the surface resistance of the wafer The probe 2 of the measuring machine is easy to penetrate completely, so that the metal probe 1 of the wafer surface resistance measuring machine is in contact with the surface of the polychip 4, resulting in a short circuit, and it is impossible to accurately measure the surface resistance of the polychip 2
[0005] Therefore, the probe of the wafer surface resistance measuring machine is not suitable for measuring the surface resistance of polychip, which restricts the use of polychip

Method used

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Embodiment Construction

[0030] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. Of course, the present invention can also have other embodiments besides these detailed descriptions.

[0031] The invention proposes a resistance measuring probe, which is equipped with gaskets on the probe, has a simple structure, can prevent short circuits, avoids contact between metal probes and wafers, and ensures the accuracy of wafer measurement results.

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described examples are only some examples of the present invention, not all examples. Based on the examples summarized in the present invention, all examples obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] It should be noted tha...

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Abstract

The present invention relates to the field of semiconductor testing equipment, in particular to a resistance measuring probe, comprising: a probe housing connected to resistance measuring equipment for measuring wafer resistance; a probe set at the bottom of the probe housing for connecting to the Said wafer; Gasket, arranged at the bottom of said probe shell, in order to limit the depth of said probe penetrating into said wafer. The resistance measuring probe of the present invention is equipped with gaskets on the probe, has a simple structure, can prevent short circuit from contacting, avoids metal probes and wafers, and ensures the accuracy of wafer measurement results.

Description

technical field [0001] The invention relates to the field of semiconductor testing equipment, in particular to a resistance measuring probe. Background technique [0002] The semiconductor testing process belongs to the key field of the semiconductor industry. Testing the surface resistance of the wafer is an important part of the semiconductor testing process. At present, the commonly used wafers are silicon wafers or polychips. soft. Usually, the surface resistance of the wafer is tested by using a wafer surface resistance measuring machine (KLA Tencor). [0003] figure 1 It is a schematic diagram of measuring the surface resistance of a silicon wafer in the background technology of the present invention. As shown in the figure, since the surface of the silicon wafer 3 is relatively hard, the probe 2 of the wafer surface resistance measuring machine will not be completely penetrated, and the wafer surface resistance measurement The shell of the metal probe 1 of the mach...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R27/02G01R31/26G01R1/067H01L21/66
CPCG01R1/067G01R1/06711G01R27/02G01R31/26H01L22/14
Inventor 刘纪伟张伟光
Owner WUHAN XINXIN SEMICON MFG CO LTD