Back technique for semiconductor ultrathin device
A backside technology, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., to achieve the effect of high technology maturity and good market application prospects
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[0028] A backside process method for semiconductor ultra-thin devices, including the following steps:
[0029] 1) Wafer bonding: The semiconductor wafer 1 coated with a high-temperature bonding agent 2 on the front side is bonded to the first carrier 4 coated with a low-temperature bonding agent 3, and the structure after bonding is as follows figure 1 Shown
[0030] 2) Backside process: The wafer in step 1) is thinned into ultra-thin sheets, and then conventional backside processes such as through-holes on the backside and backside metallization are completed in sequence. After the conventional backside process, the structure is as follows figure 2 Shown
[0031] 3) Wafer separation: After step 2) is completed, the low-temperature bonding agent 3 is softened by the thermal separation method to realize the separation of the super thin film and the first carrier 4. The structure of the super thin wafer after separation is as follows image 3 Shown
[0032] 4) Super thin sheet secondary...
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