Fan-out type packaging structure based on multiple layers of chips of organic substrate and packaging method
A multi-layer chip and packaging structure technology, applied in photovoltaic power generation, electrical components, climate sustainability, etc., can solve the problems of difficulty in applying large-scale mass production requirements, small application range, and low processing cost, and achieve improved heat dissipation Performance and electromagnetic shielding performance, wide application range, low CTE effect
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[0036] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0037] Such as figure 1 with Figure 8 Shown: In order to have high packaging integration, reduce packaging costs, and be suitable for mass production requirements, the present invention includes a lower organic core board 1, on which a dielectric layer 6 is laminated with multiple layers Chip, the multilayer chip is supported in the lower organic chip 1 and located in the dielectric layer 6; above the dielectric layer 6 is provided with solder balls 12 for electrical connection with the multilayer chip; the lower organic core board 1 is provided with heat dissipation pillars 7. The heat dissipation column 7 penetrates through the lower organic core board 1 and contacts the chips adjacent to the lower organic core board 1.
[0038] Specifically, the heat dissipating pillar 7 may be a copper pillar, and the contact between the heat dissipating pillar 7 and the multi...
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