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Anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and anti-overheating CSP fluorescent diaphragm mould pressing method

A fluorescent film, anti-overheating technology, used in lighting devices, light sources, lighting and heating equipment, etc., can solve problems such as overheating of fixtures and melting of fluorescent film, and achieve the effects of easy control, improved service life, and reduced impact wear

Active Publication Date: 2017-02-22
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above-mentioned process defects to be solved urgently in the production, the present invention proposes an anti-overheating CSP fluorescent film molding device and method, which solves the technical problems of overheating of the clip body and early melting of the fluorescent film due to the difference in operating time of the operator

Method used

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  • Anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and anti-overheating CSP fluorescent diaphragm mould pressing method
  • Anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and anti-overheating CSP fluorescent diaphragm mould pressing method
  • Anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and anti-overheating CSP fluorescent diaphragm mould pressing method

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Experimental program
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Effect test

Embodiment 1

[0054] In the device adopted in this embodiment, the elastic supporting structure is a spring leaf, and the stiffness of the spring leaf along the die direction is 10N / cm; 3% of the surface area, the contact between the spring leaf and the lower die main body 6 is a line contact, and the contact area is 3% of the upper surface area of ​​the lower die main body 6; The contact area of ​​the upper surface of 6 is 95% of the lower bottom surface area of ​​lower fixture 5.

[0055] The above-mentioned overheating preventing CSP fluorescent film molding device is used to realize the molding of the CSP fluorescent film.

[0056] (1) The heating devices of the upper and lower dies are activated, the dies are preheated, and the temperature is maintained at 78°C;

[0057] (2) The upper fixture 3 and the lower fixture 5 are controlled and separated by the feeding device 16, and the lower fixture 5 and the lower die body 6 are separated by 1mm through the elastic support structure;

[0...

Embodiment 2

[0065] In the device adopted in this embodiment, the elastic support structure is a spring leaf, and the stiffness of the spring leaf along the die direction is 25N / cm; 5% of the surface area, the contact between the spring leaf and the lower die main body 6 is a line contact, and the contact area is 5% of the upper surface area of ​​the lower die main body 6; The contact area of ​​the upper surface of 6 is 90% of the lower bottom surface area of ​​lower fixture 5.

[0066] The above-mentioned overheating preventing CSP fluorescent film molding device is used to realize the molding of the CSP fluorescent film.

[0067] (1) The heating devices of the upper and lower dies are activated, the dies are preheated, and the temperature is maintained at 82°C;

[0068] (2) The upper fixture 3 and the lower fixture 5 are controlled and separated by the feeding device 16, and the lower fixture 5 and the lower die body 6 are separated by 10mm through the elastic support structure;

[006...

Embodiment 3

[0076] In the device adopted in this embodiment, the elastic support structure is a spring leaf, and the stiffness of the spring leaf along the die direction is 20N / cm; 5% of the surface area, the contact between the spring leaf and the lower die main body 6 is a line contact, and the contact area is 5% of the upper surface area of ​​the lower die main body 6; The contact area of ​​the upper surface of 6 is 93% of the lower bottom surface area of ​​lower fixture 5.

[0077] The above-mentioned overheating preventing CSP fluorescent film molding device is used to realize the molding of the CSP fluorescent film.

[0078] (1) The heating devices of the upper and lower dies are started, the dies are preheated, and the temperature is maintained at 80°C;

[0079] (2) The upper fixture 3 and the lower fixture 5 are controlled and separated by the feeding device 16, and the lower fixture 5 and the lower die body 6 are separated by 8 mm through the elastic support structure;

[0080]...

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Abstract

The invention discloses an anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and an anti-overheating CSP fluorescent diaphragm mould pressing method. The anti-overheating CSP fluorescent diaphragm mould pressing device comprises a frame (12), a mould pressing device body (13), a force measurement device (14), a control device (15) and a feeding device (16), wherein the mould pressing device body (13) comprises an upper pressing mould, an upper fixture (3), a lower pressing mould, guide posts (4), elastic supporting structures (10) and a lower fixture (5). The anti-overheating CSP fluorescent diaphragm mould pressing device has the advantages that a phase of compressing the elastic supporting structures is added during mould pressing, so that mould clamping force in mould pressing increases steadily, the force impact on the mould pressing device during mould clamping is reduced, and a holding start point for mould pressing is determined conveniently; the lower fixture is effectively prevented from overheating due to being in large-area contact with a heating lower pressing mould for a long time, the process defect that a fluorescent diaphragm melts in advance due to overheating is avoided, homogeneity of products produced according to a CSP fluorescent diaphragm mould pressing technology is improved substantially, and yield of the products is increased substantially.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a molding device and method for preventing overheating of a CSP fluorescent membrane. Background technique [0002] With the development of LED technology and cost reduction, the packaging volume of LED devices is getting smaller and smaller, and the power density is constantly increasing. Chip-scale package (CSP) devices can avoid gold wires, and the substrate is extremely small or even does not need a substrate, thereby greatly reducing the device volume and reducing packaging costs by up to 20%. In addition, the thermal resistance of CSP devices is also reduced, and the luminescence of CSP The density is improved, and the small, thin, and light features of CSP greatly improve the flexibility of its design and application. Therefore, CSP packaging is widely used in different fields, and the market demand is experiencing rapid growth. [0003] At present, CSP phosphor co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L33/50
CPCH01L33/505H01L21/68785H01L2933/0041Y02P40/57F21K9/90F21K99/00H01L33/48
Inventor 李宗涛林庆宏汤勇余树东王卉玉梁观伟陆龙生
Owner SOUTH CHINA UNIV OF TECH
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