Package structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., can solve the problems of shortening the service life of fingerprint image sensors, and the surface of the sensing area A is easily damaged, so as to avoid electronic components. Ineffective effect

Inactive Publication Date: 2017-03-15
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the silicon fingerprint image sensor needs to directly touch the sensing area A of the sensing chip 11 with a finger, so the surface of the sensing area A is easily damaged, thus shortening the service life of the existing fingerprint image sensor

Method used

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  • Package structure and manufacturing method thereof
  • Package structure and manufacturing method thereof
  • Package structure and manufacturing method thereof

Examples

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Embodiment Construction

[0048] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0049] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. condition, so it has no technical substantive meaning, and any modification of structure, change of proportional relationship...

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Abstract

The invention discloses a package structure and a manufacturing method thereof. The package structure includes: a substrate, an electrical element which is arranged on the substrate and has a sensing region, a package layer which is arranged on the substrate and covers the electrical element, and a cover body which is arranged on the package layer and covers the sensing region, such that the cover body is engineered to prevent direct contact of a finger to the sensing region. Therefore, the package structure overcomes the defect of ineffectiveness of electrical element caused by damage to the sensing region.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure of a fingerprint sensor. Background technique [0002] With the improvement of living standards, consumers pay more and more attention to privacy. Many high-end electronic products will be equipped with identification systems to increase the security of data in electronic products. Therefore, the development and design of identification systems are also following consumers. Demand has become the direction of electronics industry development. [0003] In the development of the technology industry, in the identification system, it is developing towards the biometric system (biometric). In the biometric identification system, according to the different identification marks, it can be divided into two types of biometric identification systems that identify biological characteristics (such as fingerprints, pupils, faces, and voiceprints) and behavioral characteristics (s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L21/50G06K9/00
CPCH01L21/50H01L23/04G06V40/1318H01L2924/181H01L2924/1815H01L2224/16225H01L2224/33H01L2224/48091H01L2224/73265H01L2924/00014H01L2924/00012
Inventor 唐绍祖蔡岳颖蔡瀛洲
Owner SILICONWARE PRECISION IND CO LTD
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