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Box-type semi-conductor refrigerating device

A refrigeration device and semiconductor technology, applied in refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of large difference between refrigeration efficiency and theoretical value, difficulty in adapting to changing environments, poor heat dissipation, etc., and achieve compact structure , Improve the heat dissipation effect and facilitate the production

Inactive Publication Date: 2017-03-22
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although many researchers have invested a lot of energy in related research, the semiconductor refrigeration technology still has the following problems: the heat dissipation effect is poor, and the actual cooling efficiency is quite different from the theoretical value; the power of the semiconductor refrigeration system is stable, and it is difficult to adapt to the changing environment; The energy required by the system is provided by the grid, and the mobility is poor

Method used

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  • Box-type semi-conductor refrigerating device
  • Box-type semi-conductor refrigerating device
  • Box-type semi-conductor refrigerating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as Figure 1 to Figure 3 As shown, the box-type semiconductor refrigeration device includes a box body 1, a semiconductor refrigeration mechanism 2, a controller 3 and a fan 4; The upper end of the box body 1 is provided with a wind chamber 7 for installing the fan 4, and the lower end of the box body 1 is provided with a control chamber 8 for installing the controller 3; a partition 9 is provided between the cold air channel 5 and the heat dissipation channel 6, The semiconductor refrigeration mechanism 2 is installed between the cold air passage 5 and the heat dissipation passage 6 through the partition plate 9, and the cold guide end of the semiconductor refrigeration mechanism 2 is inserted into the cold air passage 5, and the heat dissipation end of the semiconductor refrigeration mechanism 2 is inserted into the heat dissipation passage 6. One end of the cold air passage 5 is provided with a first air inlet 10, and the first air inlet 10 is located above the ...

Embodiment 2

[0036] This box-type semiconductor refrigeration device is the same as Embodiment 1 except for the following technical features: the lower side of the cold air channel is an inclined surface, and the lower side of the cold air channel gradually rises from the outer end to the inner end of the cold air channel; the heat dissipation channel The bottom of the heat dissipation channel is an inclined surface, and the bottom of the heat dissipation channel gradually rises from the outer end to the inner end of the heat dissipation channel. The function of the inclined surface is the same as that of the arc, both of which are to ensure the smoothness of the air flow.

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PUM

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Abstract

The invention discloses a box-type semi-conductor refrigerating device which comprises a box body, a semi-conductor refrigerating mechanism, a controller and a fan. The box body is internally provided with a cold wind channel, a heat dissipating channel, a wind cavity and a control cavity. A partition plate is arranged between the cold wind channel and the heat dissipating channel. The semi-conductor refrigerating mechanism is installed between the cold wind channel and the heat dissipating channel. The cold guide end of the semi-conductor refrigerating mechanism is inserted into the cold wind channel. The heat dissipating end of the semi-conductor refrigerating mechanism is inserted into the heat dissipating channel. A first wind inlet is formed in one end of the cold wind channel and located above the cold guide end of the semi-conductor refrigerating mechanism. A second wind inlet is formed in one end of the heat dissipating channel and located above the heat dissipating end of the semi-conductor refrigerating mechanism. A top plate of the box body is provided with a main wind inlet which is located above the fan. Two side plates of the box body are provided with a cold wind outlet and a hot wind outlet correspondingly. The box-type semi-conductor refrigerating device is compact in structure, small in size, convenient to carry, suitable for small fast refrigerating application and good in maneuverability.

Description

technical field [0001] The invention relates to refrigeration technology, in particular to a box-type semiconductor refrigeration device. Background technique [0002] As people pay more and more attention to living standards and environmental protection, the survival of traditional mechanical refrigeration equipment is put to the test. The traditional mechanical refrigeration equipment has a lot of noise due to the compressor and other components, and the working medium used for heat transfer will generally cause damage to the natural environment, and there is currently no effective refrigerant recovery mechanism. Therefore, developing a new type of refrigeration technology to achieve energy saving and environmental protection is the key content of research in the field of refrigeration today. [0003] Semiconductor refrigeration has developed rapidly in recent years. Semiconductor refrigeration does not require compressors and other devices, and the working noise is much...

Claims

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Application Information

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IPC IPC(8): F25B21/02F25B49/00
CPCF25B21/02F25B49/00F25B2321/0251F25B2321/023F25B2321/0212F25B2321/003
Inventor 方利国黄江常郭欣金硕冯锦新
Owner SOUTH CHINA UNIV OF TECH