Circuit board lamination method and system
A board stacking and circuit board technology, applied in the field of circuit board stacking methods and systems, can solve the problems of low production efficiency and product qualification rate of circuit boards, and failure to meet the production process capabilities of manufacturers.
Active Publication Date: 2017-04-26
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, the circuit board stacking designed by manual operation may not meet the manufacturer's production process capabilities, and corresponding training for personnel capabilities is required, which easily leads to low production efficiency and product qualification rate of circuit boards
Method used
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Embodiment Construction
[0022] Embodiments of the present invention are described in detail below:
[0023] Such as figure 1 as shown, figure 1 It is a flowchart of the circuit board lamination method described in an embodiment; the circuit board lamination method described in the embodiment of the present invention includes the following steps:
[0024] Step S101, storing the thickness information corresponding to the copper foil layer model, the thickness information corresponding to the plate layer model and the thickness information corresponding to the prepreg layer model; in step S101, the copper foil layers of different manufacturers have different models, and the copper foil layers of different models The thickness is different; the models of the plate layers of different manufacturers are different, and the thickness of the plate layers of different models is different; the models of the prepreg layers of different manufacturers are different, and the thickness of the prepreg layers of diff...
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The invention discloses a circuit board lamination method and system; the method comprises the following steps: storing thickness information corresponding to copper foil layer models, thickness information corresponding to sheet material layer models and thickness information corresponding to prepreg layer models; obtaining circuit board layer information and material model information in a circuit board file; forming a stack frame according to the circuit board layer information; selecting a plurality of first material model combinations satisfying technology capability from the material model information; obtaining the stack frame thickness information according to the thickness information corresponding to each material model in the first material model combination, and selecting a second material model combination from the first material model combinations, wherein the selected second material model combination has the thickness satisfying a preset value and matched with the stack frame. The method and system can determine each layer of material of the stack frame to comply with the technology capability, thus improving production efficiency and product qualified rate. In addition, the stack frame thickness satisfies the client thickness requests on the circuit board product, thus ensuring the circuit board product quality qualified rate.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board lamination method and system. Background technique [0002] The traditional circuit board lamination method is based on the thickness of the circuit board and the number of layers of the circuit board, and relying on manual experience and the material type required by the customer to manually select materials and manually perform lamination. However, the circuit board stacking designed by manual operation may not meet the production process capability of the manufacturer, and corresponding training for personnel capabilities is required, which easily leads to low production efficiency and product qualification rate of circuit boards. Contents of the invention [0003] Based on this, the present invention overcomes the defects of the prior art and provides a circuit board lamination method and system, which can make the circuit board lamination m...
Claims
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Login to View More IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/0195
Inventor 吴渝锋蒋俏俏卢贤文易利军
Owner GUANGZHOU FASTPRINT CIRCUIT TECH