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A cooling structure and intelligent gateway

A technology of intelligent gateway and heat dissipation structure, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, electrical equipment shell/cabinet/drawer, etc., can solve the problem of impossible computer heat dissipation, and achieve heat dissipation effect Excellent, enhance the user experience, promote the effect of internal heat dissipation

Active Publication Date: 2019-05-28
中科同德(北京)生态科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the volume of the gateway body, it is impossible to achieve a cooling method similar to that of a computer, that is, adding a fan on the main chip to let the fan continue to blow away the heat

Method used

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  • A cooling structure and intelligent gateway
  • A cooling structure and intelligent gateway

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 Shown is an exploded diagram of an intelligent gateway described in this embodiment. From top to bottom are the upper cover 5, the center plate 7 and the lower cover 4 respectively. The upper cover 5 and the lower cover 4 are fixedly connected up and down to form the shell of the intelligent gateway. Various interfaces are provided on the shell, and external devices or wires or cables are connected to the smart gateway through the interface. The central board 7 is a structure for realizing various transmissions and controls within the intelligent gateway, on which there is a main chip 3 for data processing and control, and the main chip 3 processes and calculates external data and issues control instructions or commands. Furthermore, various mechanisms for realizing data transmission and external control are also provided on the central board 7 , and the control of the entire intelligent gateway is realized by the main chip 3 .

[0037] Since the main...

Embodiment 2

[0042] Such as figure 2As shown, a schematic diagram of the internal structure of an intelligent gateway described in this embodiment. When the upper cover 5 of the intelligent gateway is removed, as shown in the figure, there is a central board 7 in the center of the intelligent gateway, and the main chip 3 is arranged on the central board 7, where the main chip 3 has been covered by the heat sink. The heat conduction unit 1 is covered with tiles on the upper part of the main chip 3, and the heat dissipation unit 2 is mounted on the upper part of the heat conduction unit 1, and the two are closely connected to cooperate to realize heat dissipation. The main principle of heat dissipation is to increase the heat dissipation area of ​​the same unit of heat, realize the heat dissipation per unit time, and improve the heat dissipation efficiency. In this embodiment, the heat conduction unit 1 that can conduct heat quickly absorbs the heat of the heating element, that is, the main...

Embodiment 3

[0044] This embodiment is a further limitation of the first embodiment above. The surface of the heat dissipation unit 2 is coated with a heat conduction material, or the heat dissipation unit 2 is made of a heat conduction material. The advantage of this design is that the heat absorption capacity of the heat dissipation unit 2 is more Strong, rapid heat absorption, further promote its heat dissipation effect.

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Abstract

The invention discloses a heat radiation structure. The heat radiation structure comprises a heat conduction unit used for absorbing and transmitting heat of a heat-generating body, and a heat radiation unit which is connected with the heat conduction unit and is used for absorbing heat from the heat conduction unit, wherein the heat radiation unit has a heat radiation surface area which bends and extends, and heat is radiated through the heat radiation surface area. The invention further discloses an intelligent gateway, the intelligent gateway is equipped with the heat radiation structure and is in matching with a casing heat radiation hole to realize heat radiation of an inner main chip. The intelligent gateway is advantaged in that heat radiation is realized through the heat radiation structure in matching with the heat radiation hole, heat generated by the main chip in limit space is radiated out, work temperature of the intelligent gateway is reduced, and service life is prolonged.

Description

technical field [0001] The invention belongs to the field of smart home, and in particular relates to a heat dissipation structure capable of heat dissipation and an intelligent gateway. Background technique [0002] Smart home is based on the residence as a platform, using integrated wiring technology, network communication technology, security technology, automatic control technology, audio and video technology to integrate the facilities related to home life, build an efficient management system for residential facilities and family schedules, and improve Home safety, convenience, comfort, artistry, and to achieve an environmentally friendly and energy-saving living environment. [0003] The smart gateway is the heart of the smart home. Through it, the collection of system information, information input, information output, centralized control, remote control, linkage control and other functions are realized, which is no different from a computer. However, due to the lim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K5/02
CPCH05K5/0213H05K7/2039
Inventor 孙熙航冯启源王禹稼马建伟徐广勇廉季平贾永超
Owner 中科同德(北京)生态科技有限公司