A cooling structure and intelligent gateway
A technology of intelligent gateway and heat dissipation structure, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, electrical equipment shell/cabinet/drawer, etc., can solve the problem of impossible computer heat dissipation, and achieve heat dissipation effect Excellent, enhance the user experience, promote the effect of internal heat dissipation
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Embodiment 1
[0036] Such as figure 1 Shown is an exploded diagram of an intelligent gateway described in this embodiment. From top to bottom are the upper cover 5, the center plate 7 and the lower cover 4 respectively. The upper cover 5 and the lower cover 4 are fixedly connected up and down to form the shell of the intelligent gateway. Various interfaces are provided on the shell, and external devices or wires or cables are connected to the smart gateway through the interface. The central board 7 is a structure for realizing various transmissions and controls within the intelligent gateway, on which there is a main chip 3 for data processing and control, and the main chip 3 processes and calculates external data and issues control instructions or commands. Furthermore, various mechanisms for realizing data transmission and external control are also provided on the central board 7 , and the control of the entire intelligent gateway is realized by the main chip 3 .
[0037] Since the main...
Embodiment 2
[0042] Such as figure 2As shown, a schematic diagram of the internal structure of an intelligent gateway described in this embodiment. When the upper cover 5 of the intelligent gateway is removed, as shown in the figure, there is a central board 7 in the center of the intelligent gateway, and the main chip 3 is arranged on the central board 7, where the main chip 3 has been covered by the heat sink. The heat conduction unit 1 is covered with tiles on the upper part of the main chip 3, and the heat dissipation unit 2 is mounted on the upper part of the heat conduction unit 1, and the two are closely connected to cooperate to realize heat dissipation. The main principle of heat dissipation is to increase the heat dissipation area of the same unit of heat, realize the heat dissipation per unit time, and improve the heat dissipation efficiency. In this embodiment, the heat conduction unit 1 that can conduct heat quickly absorbs the heat of the heating element, that is, the main...
Embodiment 3
[0044] This embodiment is a further limitation of the first embodiment above. The surface of the heat dissipation unit 2 is coated with a heat conduction material, or the heat dissipation unit 2 is made of a heat conduction material. The advantage of this design is that the heat absorption capacity of the heat dissipation unit 2 is more Strong, rapid heat absorption, further promote its heat dissipation effect.
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