A kind of graphene-containing composite electronic heat conduction and heat dissipation material and its preparation method and application

A heat-dissipating material, graphene technology, applied in heat exchange materials, chemical instruments and methods, fibrous fillers, etc., can solve the problems of high thermal conductivity and low thermal radiation rate of metals, achieve simple operation and save production costs , easy to use effect

Active Publication Date: 2018-11-13
SOUTH CENTRAL UNIVERSITY FOR NATIONALITIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of high metal thermal conductivity and low heat radiation rate in the prior art, the present invention provides a graphene / silicon dioxide / alumina composite filler applied to the preparation of heat dissipation materials, and the prepared composite filler It has the advantages of high thermal conductivity, high emissivity, and good heat transfer to the interface with the film-forming substance, so that the prepared graphene-containing composite electronic heat conduction and heat dissipation material has good heat conduction and heat dissipation effects

Method used

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  • A kind of graphene-containing composite electronic heat conduction and heat dissipation material and its preparation method and application
  • A kind of graphene-containing composite electronic heat conduction and heat dissipation material and its preparation method and application
  • A kind of graphene-containing composite electronic heat conduction and heat dissipation material and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0027] At room temperature, mix 5g of graphene, 30g of aluminum isopropoxide, 50mL of ethyl orthosilicate, 6mL of n-butyl titanate, and 350mL of ethanol, stir for 15 minutes, and mix well; then slowly add 8mL of ammonia water dropwise, and continue stirring for 2 hours , separating the obtained reaction liquid from solid to liquid, and drying the solid to obtain the graphene / silicon dioxide / alumina / titania composite filler.

[0028] At room temperature, add the obtained graphene / silicon dioxide / alumina / titania composite filler into 150g of water-based acrylic resin, continue stirring for 30 minutes, then add 20g of magnesium oxide, stir and disperse for 2 hours, and obtain a graphene-containing composite filler. Electronic heat conduction and heat dissipation materials.

Embodiment 2

[0030] At room temperature, mix 15g of sulfur-doped graphene, 75g of aluminum isopropoxide, 100mL of ethyl orthosilicate, 3mL of n-butyl titanate, and 750mL of ethanol, stir for 15 minutes, and mix well; then slowly add 15mL of ammonia water dropwise, continue After stirring for 2 hours, the obtained reaction solution was separated from solid to liquid, and the solid was dried to obtain the graphene / silicon dioxide / alumina / titania composite filler.

[0031] At room temperature, add the obtained graphene / silicon dioxide / alumina / titania composite filler into 500g of water-based polyurethane, continue stirring for 30 minutes, then add 60g of boron nitride, stir and disperse for 2 hours, and obtain a graphene-containing composite filler. Electronic heat conduction and heat dissipation materials.

Embodiment 3

[0033] At room temperature, 5g of phosphorus-doped graphene, 15g of aluminum nitrate, 25mL of ethyl orthosilicate, 8mL of titanium tetrachloride, and 150mL of ethanol were stirred together for 15 minutes and mixed uniformly; then slowly added dropwise an aqueous solution containing 5g of sodium bicarbonate, Stirring was continued for 2 hours, the obtained reaction solution was separated from solid to liquid, and the solid was dried to obtain the graphene / silicon dioxide / alumina / titania composite filler.

[0034] At room temperature, the obtained graphene / silicon dioxide / alumina / titania composite filler was added to 75g of water-based epoxy resin, continued to stir for 30 minutes, then added 10g of iron oxide, stirred and dispersed for 2 hours to obtain graphene-containing Composite electronic heat conduction and heat dissipation materials.

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PUM

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Abstract

The invention discloses a preparation method of a graphene stable colloid. The method comprises the following steps: by using inorganic nanoparticles (such as carbon nano quantum dots, graphene oxide, acidified nanotubes and graphene quantum dots) assisted by surfactants (such as 3-[3-(cholamidopropyl)dimethylamino]propanesulfonic acid inner salt, bis hexadecyldimethyl ammonium bromide, hexadecyldimethyl benzyl ammonium bromide and n-hexadecyl-beta-D-maltoside) and one or more additives polymer (stearyl alcohol epoxyethane polyether, cellulose nanocrystal and the like), carrying out high-speed mixing and shearing, and carrying out ultrasonic treatment to strip or disperse graphite or graphene, thereby obtaining the long-term stable graphene colloid. The method is simple; and the prepared graphene colloid has long-term stability, can be divided into a water-soluble colloid and an oil-soluble colloid, and is beneficial to practical application of graphene. The film prepared by carrying out vacuum filtration on the graphene colloid is hopeful to be used as a graphene electrode, graphene composite material, graphene coating or graphene fiber composite material.

Description

technical field [0001] The invention belongs to heat-conducting and heat-dissipating materials, in particular to a graphene-based composite filler and a graphene-containing composite electronic heat-conducting and heat-dissipating material prepared by using the composite filler. Background technique [0002] As the power density and integration density of electronic devices and equipment are getting higher and higher, the heat dissipation requirements of electronic devices and equipment are becoming more and more important. Electronic devices and equipment will generate a lot of heat during operation. If the heat is not dissipated, it will affect the life of electronic devices and equipment and the stability of device performance. At present, the heat dissipation materials of electronic devices and equipment generally use metals with high thermal conductivity such as aluminum, copper, silver, etc. The above-mentioned metals have high thermal conductivity but low thermal radi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09C1/00C09C3/06C09C3/08C09C3/10C09K5/14
CPCC01P2006/32C09C1/0084C09C3/003C09C3/006C09C3/06C09C3/08C09C3/10C09K5/14
Inventor 杨应奎邱胜强陆赟张爱清
Owner SOUTH CENTRAL UNIVERSITY FOR NATIONALITIES
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