A kind of graphene-containing composite electronic heat conduction and heat dissipation material and its preparation method and application

Abstract

The invention discloses a preparation method of a graphene stable colloid. The method comprises the following steps: by using inorganic nanoparticles (such as carbon nano quantum dots, graphene oxide, acidified nanotubes and graphene quantum dots) assisted by surfactants (such as 3-[3-(cholamidopropyl)dimethylamino]propanesulfonic acid inner salt, bis hexadecyldimethyl ammonium bromide, hexadecyldimethyl benzyl ammonium bromide and n-hexadecyl-beta-D-maltoside) and one or more additives polymer (stearyl alcohol epoxyethane polyether, cellulose nanocrystal and the like), carrying out high-speed mixing and shearing, and carrying out ultrasonic treatment to strip or disperse graphite or graphene, thereby obtaining the long-term stable graphene colloid. The method is simple; and the prepared graphene colloid has long-term stability, can be divided into a water-soluble colloid and an oil-soluble colloid, and is beneficial to practical application of graphene. The film prepared by carrying out vacuum filtration on the graphene colloid is hopeful to be used as a graphene electrode, graphene composite material, graphene coating or graphene fiber composite material.

Description

technical field [0001] The invention belongs to heat-conducting and heat-dissipating materials, in particular to a graphene-based composite filler and a graphene-containing composite electronic heat-conducting and heat-dissipating material prepared by using the composite filler. Background technique [0002] As the power density and integration density of electronic devices and equipment are getting higher and higher, the heat dissipation requirements of electronic devices and equipment are becoming more and more important. Electronic devices and equipment will generate a lot of heat during operation. If the heat is not dissipated, it will affect the life of electronic devices and equipment and the stability of device performance. At present, the heat dissipation materials of electronic devices and equipment generally use metals with high thermal conductivity such as aluminum, copper, silver, etc. The above-mentioned metals have high thermal conductivity but low thermal radi...

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Problems solved by technology

[0003] In order to solve the problems of high metal thermal conductivity and low heat radiation rate in the prior art, the present invention provides a graphene / silicon dioxide / alumina composite filler applied to the preparation of heat dissipation materials, and the prepared composite filler It has the advantages of high thermal conductivity, high emissivity, and good heat transfer to the interface with the film-forming substance, so that the prepared graphene-containing composite electronic heat conduction and heat dissipation material has good heat conduction and heat dissipation effects

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