Online upgrading method for DSP chip

A chip and program upgrade technology, applied in the fields of instruments, electrical digital data processing, program control devices, etc., can solve the problems of complex program programming process, long program upgrade time, limited programming speed, etc., to shorten the upgrade time, The effect of increasing efficiency, increasing efficiency and speed

Inactive Publication Date: 2017-05-10
NANJING SCIYON AUTOMATION GRP
View PDF9 Cites 32 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The programming methods mentioned above generally have some common problems: limited programming speed leads to a long program upgrade time; embedded devices are generally enclosed in the box, which will bring inconveni

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Online upgrading method for DSP chip
  • Online upgrading method for DSP chip
  • Online upgrading method for DSP chip

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0043] The present invention will be described in detail below in conjunction with the drawings.

[0044] Such as figure 1 As shown, the DSP chip online upgrade system of the present invention includes a COFF file analysis module, a command operation module, an application download module, a status information module, and a CAN communication module set in the upper computer, and a secondary boot set in the lower computer DSP chip. Start module, user program upgrade module. After the COFF file analysis module analyzes the COFF file, it sends the extracted segment data to the DSP chip through the CAN communication module. The command operation module of the upper computer sends the upgrade, detection, erasure, write, and exit commands to the lower computer DSP chip via the CAN communication module. The application download module sets up the three detection processes of the upper computer, and sends the data segment parsed by the upper computer to the DSP chip in packets. The sta...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an online upgrading method for a DSP chip. According to the upgrading method, the DSP chip of each node is subjected to online program upgrading through a CAN communication bus; and the DSP chip is a DSP chip of TMS320F2833x series. The DSP chip of each node is subjected to the online program upgrading through the CAN bus, so that the efficiency and speed of performing online upgrading and program replacement on a target board are greatly improved, and a complex program writing process and inconvenience caused by embedded box packaging are avoided.

Description

technical field [0001] The invention relates to a DSP online upgrading method based on CAN communication. Background technique [0002] At present, there are several ways to burn DSP programs: [0003] Emulator burning program: first connect the emulator to the JTAG interface of the DSP, and at the same time connect it to the computer with the emulator driver and CCS application software installed. However, the embedded device in this way is inconvenient to connect to the JTAG port in the airtight box, which will bring great inconvenience to the upgrade, and the limited programming speed leads to the limited communication speed, which cannot meet the needs of users. [0004] Select the chip boot program through the DIP switch on the target board, and download the program using SPI\SCI serial port and other communication methods. Because this method needs to select the DIP switch and operate the target board, once the controller is sealed, it is no longer convenient for use...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F9/445
CPCG06F8/656
Inventor 祖利辉丁茂实张浩
Owner NANJING SCIYON AUTOMATION GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap