Wafer-level method for packaging camera modules and related camera modules

Abstract

A wafer-level method for packaging a plurality of camera modules comprising (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) placing a plurality of lens units respectively on the plurality of image sensors in a first wafer, and (c) overmolding a second wafer on the first wafer and around the lens units housing material to form a second wafer of packaged camera modules, each packaged camera module including one of the image sensors and one of the lens units, and the second housing The material cooperates with the first housing material to fix the lens unit in the second wafer.

Description

[0001] Related applications [0002] This application is a continuation-in-part of US Patent No. 14 / 605,298 filed on January 26, 2015, which is incorporated herein by reference in its entirety. Background technique [0003] Cameras have been incorporated into various devices. For example, widely used consumer electronic devices such as cell phones, tablet computers, and portable computers include cameras. In order to meet the target cost of such devices, the camera must be manufactured at very low cost. The manufacturing cost of a typical camera module is composed of (a) material costs, such as image sensor, lens material, and packaging materials, and (b) packaging costs (including assembly). In many cases, packaging costs are significant and may even exceed material costs. For example, both the image sensor and the lens can be produced cheaply at the wafer level, while the process of aligning the lens with the image sensor and forming the light-tight housing of the camera ...

AI Technical Summary

Problems solved by technology

The process of packaging array cameras is therefore particularly expensive

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