Polysilicon wafer containing inverted pyramid textured structure and its application
A technology of polycrystalline silicon wafers and quadrangular pyramids, which is applied in the field of solar cells, can solve the problem of anti-reflection effect, the efficiency of silicon wafer cells is difficult to be further improved, and the size is different.
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[0058] In a specific embodiment, the preparation method comprises the steps of:
[0059] 1) The polycrystalline silicon wafer is placed in an acidic texturing solution, etched at 20°C to 35°C for 1 to 10 minutes, and the metal ions on the surface of the silicon wafer are cleaned and removed;
[0060] 2) Put the cleaned polysilicon wafer with the textured structure of the inverted square pyramid in alkali solution, carry out structural modification at 20° C. to 30° C. for 5-90 seconds, and then wash to obtain the finished product.
[0061] Specifically, in step 1), the etching temperature can be 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34 or 35°C; the etching time can be for 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10 minutes.
[0062] In step 2), the structural modification temperature can be 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 or 30°C; the structural modification time can be 5, 10, 20, 30, 40, 50 , 60, 70, 80 or 90s.
[0063] In order to obtain the best technical eff...
Embodiment 1
[0066] 1) Place the silicon wafer in HF+HNO 3 Carry out chemical etching in the solution to remove the damaged layer on the surface of polysilicon.
[0067] 2) Dip the cleaned silicon wafer into a texturing solution for etching to form a submicron inverted quadrangular pyramid textured structure on the surface of the polysilicon. The composition of the texturing solution is 1 mmol / L AgNO 3 +100mmol / L of Cu(NO 3 ) 2 +2.0mol / L of HF+0.4mol / L of H 2 o 2 , the reaction temperature is 30°C, and the reaction time is 400s;
[0068] 3) Clean the silicon wafer in deionized water; immerse the textured silicon wafer in HNO 3Washing in solution to remove surface metal nanoparticles; washing with deionized water;
[0069] 4) Dip the silicon wafer into NaOH alkali solution to make the suede structure on the surface of the silicon wafer smooth;
[0070] 5) Clean the silicon wafer in deionized water; place the cleaned silicon wafer in HCl+H 2 o 2 Washing in the solution to remove met...
Embodiment 2
[0074] 1) Place the silicon wafer in HF+HNO 3 Carry out chemical etching in the solution to remove the damaged layer on the surface of polysilicon.
[0075] 2) Dip the cleaned silicon wafer into a texturing solution for etching to form a submicron inverted quadrangular pyramid textured structure on the surface of the polysilicon. The composition of the texturing solution is 1 mmol / L AgNO 3 +50mmol / L of Cu(NO 3 ) 2 +2.5mol / L of HF+0.6mol / L of H 2 o 2 , the reaction temperature is 25°C, and the reaction time is 490s;
[0076] 3) Clean the silicon wafer in deionized water; immerse the textured silicon wafer in HNO 3 Washing in solution to remove surface metal nanoparticles; washing with deionized water;
[0077] 4) Dip the silicon wafer into NaOH alkali solution to make the suede structure on the surface of the silicon wafer smooth;
[0078] 5) Clean the silicon wafer in deionized water; place the cleaned silicon wafer in HCl+H 2 o 2 Washing in the solution to remove met...
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