Printing mechanism for raw ceramic chip through hole wall metallization
A technology of printing mechanism and green ceramic sheet, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of uneven sizing, high cost, difficult processing of porous backing plate, etc., so as to reduce processing cost and reduce The effect of processing difficulty and low precision requirements
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0019] Such as figure 1 The printing mechanism shown for the metallization of the through-hole wall of the green ceramic sheet includes: a printing platen 1, a cavity cover plate 2, a manifold plate 3, an air circuit plate 4, a mask sheet 5, a support plate 6 and an outer set negative pressure source. The middle part of the top of the printing platen 1 is provided with an elongated cavity 11, and a circle of air holes 12 is arranged around the elongated cavity; th...
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