Printing mechanism for raw ceramic chip through hole wall metallization

A technology of printing mechanism and green ceramic sheet, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of uneven sizing, high cost, difficult processing of porous backing plate, etc., so as to reduce processing cost and reduce The effect of processing difficulty and low precision requirements

Active Publication Date: 2017-05-10
西北电子装备技术研究所
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] In order to alleviate the problems of uneven slurry coating, hole blocking and porous backing plate processing difficulty and high cost in the prior art when the through-hole wall of the green ceramic sheet is metallized, the present invention proposes a method for the through-hole wall of the green ceramic sheet. metallized printing mechanism

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  • Printing mechanism for raw ceramic chip through hole wall metallization
  • Printing mechanism for raw ceramic chip through hole wall metallization

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] Such as figure 1 The printing mechanism shown for the metallization of the through-hole wall of the green ceramic sheet includes: a printing platen 1, a cavity cover plate 2, a manifold plate 3, an air circuit plate 4, a mask sheet 5, a support plate 6 and an outer set negative pressure source. The middle part of the top of the printing platen 1 is provided with an elongated cavity 11, and a circle of air holes 12 is arranged around the elongated cavity; th...

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Abstract

The present invention provides a printing mechanism for raw ceramic chip through hole wall metallization. The mechanism comprises a printing platform with a big cavity, an external negative pressure source communicated with the big cavity, a mask piece and a support plate, the mask piece is movably arranged at the upper portion of the support plate along the vertical direction, and the mask piece is provided with a through hole being consistent to a raw ceramic chip; the support plate is arranged on the printing platform, a venthole corresponding to the through hole on the mask piece is arranged on the support plate, and absorption holes are arranged at other positions of the support plate; and one way of negative voltage of the negative pressure source is communicated with the venthole, and the other way of the negative voltage of the negative pressure source is communicated with the absorption holes. The printing mechanism improves the slurry uniformity at the raw ceramic chip through hole wall metallization and alleviates the phenomenon of slurry obstructing the through hole.

Description

technical field [0001] The invention relates to the field of printing machines in the manufacturing industry of multilayer ceramic substrates, in particular to a printing mechanism for metallizing the walls of through holes of green ceramic sheets. Background technique [0002] When the hole wall of the green ceramic sheet of the multilayer ceramic substrate is metallized, the printing mechanism to realize the metallization of the hole wall is a necessary component. At present, the metallization method of the through hole wall of the green ceramic sheet is as follows: on the large cavity workbench, the green ceramic sheet is placed on the porous backing plate, and the through holes of the green ceramic sheet and the small holes of the porous backing plate are connected together. Axis correspondence, the large cavity of the workbench is connected with an external negative pressure source, use one negative pressure of the negative pressure source to adsorb the green ceramic sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/429H05K2201/095H05K2203/0736
Inventor 张志耀吕琴红田芳闫文娥
Owner 西北电子装备技术研究所
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