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Printed circuit board and liquid crystal display

A printed circuit board and width technology, which is applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problems of waste, height increase and pitch increase of anisotropic conductive film, and achieve the increase of design cost and difficulty, The effect of reducing the inflection ratio

Active Publication Date: 2017-05-17
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the pitch of the non-connected area and the pitch of the connected area adopt the same design, so when the pitch of the connected area increases due to product design requirements, the pitch of the non-connected area also increases accordingly
[0003] In this context, when the mechanism peels off the release film of the anisotropic conductive film (ACF, Anisotropic ConductiveFilm), if the attachment parameters (low temperature and low pressure) of the anisotropic conductive film remain unchanged, the anisotropic conductive film The rate of inflection (defective) at the starting point of film attachment will increase
However, if the attachment effect is improved by optimizing the attachment parameters of the anisotropic conductive adhesive film, it will increase the difficulty of attaching and adjusting the anisotropic conductive adhesive film and the manpower required for cleaning the printed circuit board. Film waste

Method used

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  • Printed circuit board and liquid crystal display
  • Printed circuit board and liquid crystal display

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] figure 2 It is a schematic diagram of the local structure of the connection area and the non-connection area of ​​the printed circuit board in the embodiment of the present invention. Combine below figure 2 The specific structure of the printed circuit board will be described in detail.

[0030] The printed circuit board is provided with at least one pair of connection area 210 and non-connection area 220 adjacent to each other.

[0031] In a pair of adjacent connection regions 210 and non-connection regions 220, the connection region 210 is equidistantly arranged with a plurality of first gold fingers 211 according to the first pitch m1, and the non-connection region 220 is provided with equidistant intervals according to the second pitch m2. A plurality of second gold fingers 221 . Wherein, the sum of the width of the first golden finger 211 and the first distance m1 is the first unit width w1, and the first unit width w1 satisfies the first width range. The sum...

Embodiment 2

[0038] This embodiment further optimizes the width w1 of the first unit and the width w2 of the second unit in the first embodiment.

[0039] In the first embodiment, the width w1 of the first unit satisfies the first width range, and the width w2 of the second unit satisfies the second width range. On this basis, this embodiment further defines the first width range and the second width range. Specifically, the lower limit of the first width range is preferably set to 400 μm, and the upper limit of the second width range is preferably set to 330 μm.

[0040] It should be noted that the present embodiment does not specifically limit the upper limit of the first width range and the lower limit of the second width range. In the specific implementation process, as long as its size meets the design requirements.

[0041] To sum up, when the width of the first unit becomes larger (greater than 400 μm) according to the requirements of the transmission signal, and the distribution ...

Embodiment 3

[0043] In this embodiment, the width w2 of the second unit in the second embodiment is further optimized.

[0044] In the second embodiment, the width w1 of the first unit satisfies the first width range, the width w2 of the second unit satisfies the second width range, and the lower limit of the first width range is 400 μm, and the upper limit of the second width range is 330 μm. On this basis, in this embodiment, the width w2 of the second unit is more specifically defined, and the width w2 of the second unit is set as a fixed size. Preferably, the width of the second cell is set to 300 μm.

[0045] In order to further demonstrate the technical effect achieved by applying the printed circuit board of this embodiment, the following two cases where the width w1 of the first unit is 440 μm and 500 μm are taken as examples, and the width of the second unit is designed to be 300 μm. Ratio effects were tested.

[0046] There are two types of test machines:

[0047] The first ty...

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Abstract

The invention discloses a printed circuit board and a liquid crystal display. The printed circuit board is provided with at least one pair of bonding region and non-bonding region adjacent to each other. A plurality of first gold fingers are equidistantly disposed in the bonding region according to a first interval, the sum of the width of the first gold fingers and the first interval is a first unit width, and the first unit width satisfies a first width range; a plurality of second gold fingers are equidistantly disposed in the non-bonding region according to a second interval, the sum of the width of the second gold fingers and the second interval is a second unit width, and the second unit width satisfies a second width range, wherein the lower limit of the first width range is greater than the upper limit of the second width range. According to the invention, the defect condition of an attaching starting point of an anisotropic conductive film can be improved effectively, and the design cost and difficulty will not increase compared with those of conventional designs.

Description

technical field [0001] The invention relates to the field of liquid crystal technology, in particular to a printed circuit board and a liquid crystal display. Background technique [0002] As the chip-on-film (COF, Chip On Film) width design increases (42mm→63mm), the pitch of the bonding area (bonding) of the printed circuit board (PCBA, Printed Circuit Board+Assembly) equipped with components (pitch is The sum of the width of a gold finger and the distance between two adjacent gold fingers) is also increasing (300μm→540μm). However, in the prior art, the pitch of the non-connected area and the pitch of the connected area adopt the same design, so when the pitch of the connected area increases due to product design requirements, the pitch of the non-connected area also increases accordingly. [0003] In this context, when the mechanism peels off the release film of the anisotropic conductive film (ACF, Anisotropic ConductiveFilm), if the attachment parameters (low temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11G02F1/133
CPCG02F1/133H05K1/11H05K2201/09663
Inventor 范林熊一平
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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